Microstructure Evolution Induced by Sliding-Based Surface Thermomechanical Treatments - Application to Pure Copper

G. Kermouche; G. Jacquet; C. Courbon; J. Rech; Y.Y. Zhang; R. Chromik

doi:10.4028/www.scientific.net/MSF.879.915

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HomeMaterials Science ForumMaterials Science Forum Vol. 879Microstructure Evolution Induced by Sliding-Based...

Microstructure Evolution Induced by Sliding-Based Surface Thermomechanical Treatments - Application to Pure Copper

Abstract:

In this paper, surface microstructural evolution induced by processes based on repeated sliding (friction) contact such as burnishing or machining is investigated. A set-up designed for simulating contact pressures and cutting speed occurring during machining is used to create a gradient of nanomicro-structure. It is composed of a top surface recrystallized layer and a sub-surface made of ultrafine grains over a depth larger than 100 μm. Induced-mechanical properties as well as resulting wear resistance are discussed. A conclusion is brought on the benefits of this new kind of sliding-based surface mechanical treatments (SMT).

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Periodical:

Materials Science Forum (Volume 879)

Pages:

915-920

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.879.915

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Online since:

November 2016

Authors:

G. Kermouche*, G. Jacquet, C. Courbon, J. Rech, Y.Y. Zhang, R. Chromik

Keywords:

Friction, Grain Refinement, Microstructure Gradient, Recrystallization, Severe Plastic Deformation (SPD), Surface Mechanical Treatment, Wear Resistance

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