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Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy

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Abstract:

The dependence of microstructure and mechanical properties of Sn-0.7wt.%Cu solder alloys on different cooling rates were investigated. Two cooling rates were employed during solidification: 0.04 °C/s (mold-cooled system) and 1.66 °C/s (water-cooled system). The results showed that the ultimate tensile strength of Sn-0.7wt.%Cu solder alloy increased but the elongation decreased when water-cooled system was used. The microstructure of Sn-0.7wt.%Cu solder alloys solidified by both cooling systems exhibited two phases of Sn-rich and Cu6Sn5 intermetallic compounds (IMCs). However, finer grains were observed in the water-cooled specimens.

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Info:

Periodical:

Key Engineering Materials (Volumes 675-676)

Pages:

513-516

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.675-676.513

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Online since:

January 2016

Authors:

Phairote Sungkhaphaitoon*, Thawatchai Plookphol

Keywords:

Cooling Rate, Intermetallic Compound, Sn-0.7wt.%Cu Solder Alloy, Tensile Strength

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