References
Thermal Spraying: Practice, Theory, and Application (American Welding Society, Miami, FL, 1985).
Thermal Spray Technology, New Ideas and Processes: Proc. of the National Thermal Spray Conf. (ASM International, Materials Park, OH, 1989-1998).
M.L. Thorpe, Adv. Mater. Proc. 143 (5) (1993) p. 50.
L. Pawlowski, The Science and Engineering of Thermal Spray Coatings (Wiley, Chichester, UK, 1995).
H. Herman and S. Sampath, in Metallurgical and Protective Coatings, edited by K. Stern (Chapman & Hall, New York, 1996) p. 261.
H. Herman, Sci. Am. 256 (September 1988) p. 112.
S. Sampath and H. Herman, J. Met. 45 (7) (1993) p. 42.
H. Kreye, in Proc. 2nd Plasma-Technik Symp., Vol. 1, edited by P. Huber (Plasma-Technik, Wohlen, Switzerland, 1991) p. 39.
J.A. Browning, J. Thermal Spray Technol 1 (4) (1992) p. 289.
P. Chraska and M. Hrabovsky in Proc. 13th Int. Thermal Spray Conf, edited by C.C. Berndt (ASM International, Materials Park, OH, 1992) p. 81.
M. Boulos, Pure Appl. Chem. 57 (9) (1985) p. 1321.
T.W. Clyne and S.C. Gill, J. Thermal Spray Technol. 5 (1996) p. 401.
O. Kesler, M. Finot, S. Suresh, and S. Sampath, Acta Mater. 45 (8) (1997) p. 3123.
J. Matejicek, S. Sampath, P.C. Brand, and H.J. Prask, Acta Mater. 47 (7) (1999) p. 607.
C.F. Rocheville, U.S. Patent No. 3,100,724 (August 13, 1963).
A.P. Alkhimov, V.F. Kosarev, and A.N. Papyrin, Sov Phys. Dokl. 35 (12) (1990) p. 1047
A.P. Alkhimov, A.N. Papyrin, V.F. Kosarev, N.I. Nesterovich, and M.M. Shushpanov, U.S. Patent No. 5,302,414 (April 12, 1994).
M.F. Smith, J.E. Brockmann, R.C. Dykhuizen, D.L. Gilmore, R.A. Neiser, and T.J. Roemer, in Solid Freeform and Additive Fabri cation, edited by D. Dimos, S.C. Danforth, and M.J. Cima (Mater. Res. Soc. Symp. Proc. 542, Warrendale, PA, 1998) p. 65.
T.H. Van Steenkiste, J.R. Smith, R.E. Teets, J.J. Moleski, D.W. Gorkiewicz, R.P Tison, D.R. Marantz, K.A. Kowalsky W.L. Riggs, II, P.H. Zajchowski, B. Pilsner, R.C. McCune, and K.J. Barnett, Surf. Coat. Technol. III (1999) p. 62.
R.C. McCune, W.T. Donlon, E.L. Cartwright, A.N. Papyrin, E.F. Rybicki, and J.R. Shadley in Proc. 9th Natl. Thermal Spray Conf, edited by C.C. Berndt (ASM International, Materials Park, OH, 1996) p. 397.
R.C. Dykhuizen, M.F. Smith, D.L. Gilmore, R.A. Neiser, X.Y. Jiang, and S. Sampath, J. Ther mal Spray Technol. 8 (4) (1999) p. 559.
J. Matejicek and S. Sampath, “Processing Effects on Residual Stresses in Single Particles,” presented at Symposium K, Materials Research Society Meeting, Boston, November 29, 1999.
R.C. McCune, W.T. Donlon, O.O. Popoola, and E.L. Cartwright, J. Thermal Spray Technol. 9 (1) (2000) p. 73.
G. Montavon, B. Robert, C. Verdy V. Monin, K.E. Atcholi, and C. Coddet, in Thermal Spray: Practical Solutions for Engineering Prob lems, edited by C.C. Berndt (ASM International, Materials Park, OH, 1996) p. 827.
D.L. Houck, Mod. Dev Powder Metall 12 (1980) p. 485.
S. Sampath and H. Herman, J. Thermal Spray Technol. 5 (4) (1996) p. 445.
S. Sampath, X. Jiang, G.X. Wang, and A. Vardelle, in Proc. 9th Symp. on Surface Engineering, Vol. 20 (CIMTEC, Florence, Italy, 1998) p. 259.
A. Dent, A. Patel, S. Sampath, and H. Herman, in Proc. Int. Thermal Spray Conf, edited by C.C. Berndt (ASM International, Materials Park, OH, 2000) p. 495.
J. Ilavsky A.J. Allen, G.G. Long, and S. Krueger, J. Am. Ceram. Soc. 80 (3) (1997) p. 733.
H. Boukari, H. Herman, C. Berndt, J. Wallace, J. Ilavsky, G. Long, and A. Allen, “The Role of Feedstock Particle Size on the Microstructural Behavior of Plasma Sprayed YSZ Deposits During Annealing,” submitted to Proc. Int. Thermal Spray. Conf.
A. Kulkarni, S. Sampath, A. Goland, H. Herman, and B. Dowd, “Computed Microtomography Studies to Characterize Microstructure- Property Correlations in Thermal Sprayed Alumina Coatings,” Scripta Mater. (2000).
T. Miyamoto and S. Sugimoto, in Proc. Intl. Thermal Spray Conf, edited by A. Ohmori (High Temperature Society of Japan, Osaka, 1995) p. 3.
A.R. Nicoll, in Proc. 7th Natl. Thermal Spray Conf, edited by C.C. Berndt and S. Sampath (ASM International, Materials Park, OH, 1994) p. 7.
O.O. Popoola, M.J. Zaluzec, and R.C. McCune, Surf. Eng 14 (2) (1998) p. 107.
R.C. McCune, Welding. 74 (8) (1995) p. 41.
H. Kuse, M. Ohtsu, H. Ito, and S. Takezaki, in SAE Tech. Paper Ser. No. 770624 (Society of Automotive Engineers, Warrendale, PA, 1977).
T. Peterman, in Proc. 13th Int. Thermal Spray Conf, edited by C.C. Berndt (ASM International, Materials Park, OH, 1992) p. 309.
D.R. White, D.E. Wilkosz, and J.A. Szuba, U.S. Patent No. 5,658,506 (August 19, 1997).
R. Goswami, J.B. Parise, S. Sampath, and H. Herman, J. Mater. Res. 14 (1999) p. 3489.
R. Goswami, H. Herman, S. Sampath, and J.B. Parise, J. Mater. Res. 15 (2000) p. 1.
E. Bouyer, F. Gitzhofer, and M.I. Boulos, J. Met. 49 (February 1997) p. 58.
P. Kong, T.T. Huang, E. Pfender, IEEE Trans. Plasma Science, PS14 (1986) p. 357.
N. Rao, S. Girshik, J. Heberlein, P. McMurry, S. Jones, D. Hansen, B. Micheel, Plasma Chem. Plasma Proc. 15 (4) (1996) p. 581.
J. Karthikeyen, J. Tikkanen, J.Y. Wang, A.H. King, H. Herman, and C.C. Berndt, Nanostruct. Mater, 9 (1997) p. 137.
D. Harris, R. Janowiecki, C. Semler, M. Willson, and J. Cheng, J. Appl. Phys. 41 (3) (1970) p. 1348.
U. Varshney, B. Eichelberger, J. Neal, R. Churchill, K. Ngo, and R. Thibodeaux, J. Physique Colloque 7 (C-1) (1997) p. 147.
R.T. Smyth and J.C. Anderson, Electrocomp. Sci. Technol. 2 (1975) p. 135.
M. Braguier, J. Bejat, R. Tueta, M. Verna, G. Aubin, and C. Naturel, in Proc. Conf. on Hybrid Microelectronics (I.E.R.E., London, 1973) p. 15.
M. Fasching, F. Prinz, and L. Weiss, J. Thermal Spray Technol. (1995) 4 (2) p. 133.
Rights and permissions
About this article
Cite this article
Herman, H., Sampath, S. & McCune, R. Thermal Spray: Current Status and Future Trends. MRS Bulletin 25, 17–25 (2000). https://doi.org/10.1557/mrs2000.119
Published:
Issue Date:
DOI: https://doi.org/10.1557/mrs2000.119