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Microstructure and compression behavior of chip consolidated magnesium

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Abstract

Chips produced by turning a commercial purity magnesium billet were cold compacted and then hot extruded at four different temperatures: 250, 300, 350, and 400 °C. Cast billets, of identical composition, were also extruded as reference material. Chip boundaries, visible even after 49:1 extrusion at 400 °C, were observed to suppress grain coarsening. Although 250 °C extruded chip-consolidated product showed early onset of yielding and lower ductility, fully dense material (extruded at 400 °C) had nearly 40% reduction in grain size with 22% higher yield strength and comparable ductility as that of the reference. The study highlights the role of densification and grain refinement on the compression behavior of chip consolidated specimens.

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ACKNOWLEDGMENTS

The work involved the Institute X-ray Facility and Institute Nanoscience Initiative (INI) facility sponsored by Department of Science and Technology under the Funds for Improvement of S&T Infrastructure in Universities and Higher Educational Institutions (DST-FIST program) at Indian Institute of Science (IISc), Bangalore. The authors would also like to acknowledge the use of the National Facility for Texture & OIM (a DST- IRPHA (Intensification of Research in High Priority Areas) facility) at Indian Institute of Technology-Bombay for this study. Adamane R. Anilchandra, would like to thank Mr. Somjeeth Biswas of IISc for the useful discussion during the course of work.

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Authors and Affiliations

  1. Department of Materials Engineering, Indian Institute of Science, Bengaluru, 560012, India

    Adamane R. Anilchandra

  2. Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology—Bombay, Mumbai, 400076, India

    Ritwik Basu & Indradev Samajdar

  3. Department of Materials Engineering, Indian Institute of Science, Bengaluru, 560012, India

    Mirle K. Surappa (Director)

  4. Indian Institute of Technology—Ropar, Rupnagar, 140001, Punjab, India

    Mirle K. Surappa (Director)

  5. Deputation from Department of Materials Engineering, Indian Institute of Science, Bengaluru, 560012, India

    Mirle K. Surappa (Director)

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  1. Adamane R. Anilchandra
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Correspondence to Adamane R. Anilchandra.

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Anilchandra, A.R., Basu, R., Samajdar, I. et al. Microstructure and compression behavior of chip consolidated magnesium. Journal of Materials Research 27, 709–719 (2012). https://doi.org/10.1557/jmr.2011.411

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