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The Influence of Temperature and Concentration on Copper Deposition Kinetics in Supercritical Carbon Dioxide

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Abstract

The kinetics of copper deposition by the hydrogen-assisted reduction of bis(2,2,7- trimethyloctane-3,5-dionato)copper in supercritical carbon dioxide was studied as a function of temperature and precursor concentration. The growth rate was found to be as high as 31.5 nm/min. Experiments between 220 °C and 270 °C indicated an apparent activation energy of 51.9 kJ/mol. The deposition kinetics were zero order with respect to precursor at 250 °C and 134 bar and precursor concentrations between 0.016 and 0.38 wt.% in CO2. Zero order kinetics over this large concentration interval likely contributes to the exceptional step coverage obtained from Cu depositions from supercritical fluids.

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Acknowledgments

Financial support from NSF (CTS-0245002) and the Camile and Henry Dreyfus Foundation is gratefully acknowledged. Instruments supported by the Materials Research Science and Engineering Center at University of Massachusetts Amherst were used in the study.

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Authors and Affiliations

  1. Department of Chemical Engineering, University of Massachusetts Amherst, Amherst, MA, 01003, USA

    Yinfeng Zong & James J. Watkins

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  1. Yinfeng Zong
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  2. James J. Watkins
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Zong, Y., Watkins, J.J. The Influence of Temperature and Concentration on Copper Deposition Kinetics in Supercritical Carbon Dioxide. MRS Online Proceedings Library 812, 86 (2003). https://doi.org/10.1557/PROC-812-F8.6

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  • DOI: https://doi.org/10.1557/PROC-812-F8.6

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