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The Mechanical Properties of Electroplated Cu Thin Films Measured by means of the Bulge Test Technique

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Abstract

The mechanical properties of freestanding electroplated Cu films were determined by measuring the deflection of Si-framed, pressurized membranes. The films were deformed under plane-strain conditions. The pressure-deflection data are converted into stress-strain curves by means of simple analytical formulae. The microstructure of the Cu films was characterized using scanning electron microscopy and x-ray diffraction. The yield stress, Young’s modulus, and residual stress were determined as a function of film thickness and microstructure. Both yield stress and Young’s modulus increase with decreasing film thickness and correlate well with changes in the microstructure and texture of the films.

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Authors and Affiliations

  1. Division of Engineering and Applied Sciences, Harvard University, Cambridge, MA, 02138, USA

    Yong Xiang, Xi Chen & Joost J. Vlassak

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  1. Yong Xiang
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  2. Xi Chen
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  3. Joost J. Vlassak
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Xiang, Y., Chen, X. & Vlassak, J.J. The Mechanical Properties of Electroplated Cu Thin Films Measured by means of the Bulge Test Technique. MRS Online Proceedings Library 695, 491 (2001). https://doi.org/10.1557/PROC-695-L4.9.1

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  • DOI: https://doi.org/10.1557/PROC-695-L4.9.1

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