Abstract
The mechanics of thin film-substrate couples indicates that mechanical stress in the active electronic layer can be reduced when films are deposited onto thinner substrates. To explore the question of just how thin a substrate can be, a-Si:H TFTs are fabricated on thin steel foil substrates of various thickness, and performance metrics from devices on each of the substrates are measured and compared.
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E. Ma and S. Wagner, in Flat-Panel Display Materials - 1998, edited by G.N. Parsons, C.C. Tsai, T.S. Fahlen, and C.H. Seager (Mater. Res. Soc. Proc.508, Pittsburgh, PA, 1998), pp.13–18.
M. Finot and S. Suresh, “Small and Large Deformation of Thick and Thin-Film Mult-Layers: Effects of Layer Geometry, Plasticity and Compositional Gradients,”J. Mech. Phys. Solids 44, (5), 683–721 (1996).
H. Gleskova, S. Wagner and Z. Suo in Flat-Panel Display Materials - 1998, edited by G.N. Parsons, C.C. Tsai, T.S. Fahlen, and C.H. Seager (Mater. Res. Soc. Proc.508, Pittsburgh, PA, 1998), pp.73-38.
D. Smith, Thin-Film Deposition: Principles and Practice, (McGraw-Hill, New York, 1995), p.495.
S.D. Theiss and S. Wagner, IEEE Electron Dev. Lett. 17, 571–580 (1996).
S.D. Theiss, C.C Wu, M. Lu, J.C. Sturm, and S. Wagner in Flat Panel Display Materials III, edited by R.T. Fulks, G.N. Parsons, D.E. Slobodin, and T.H. Yuzuriha (Mater. Res. Soc. Proc.471, Pittsburgh, PA, 1997) p.21.
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Ma, E., Wagner, S. a-Si TFTs on Thin Steel Foil Substrates: How Thin Can We Go?. MRS Online Proceedings Library 558, 381–386 (1999). https://doi.org/10.1557/PROC-558-381
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DOI: https://doi.org/10.1557/PROC-558-381