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Dependence of Hardness on Modulation Amplitude in Compositionally Modulated Cu−Ni Thin Films

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The hardness dependence on the composition modulation amplitude of electrodeposited Cu-Ni multilayered thin films was investigated. The composition modulation amplitude was reduced by annealing the films, resulting in interdiffusion between the Cu and Ni layers. The hardness enhancement ΔH over that for a completely intermixed film was measured as a function of composition modulation amplitude A. It was found that for films with a sine wave composition profile, the hardness enhancement ΔH varied as A1.1±0.1, in good agreement with the model given by Krzanowski [1].

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References

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Authors and Affiliations

  1. Department of Materials Science and Engineering, The Johns Hopkins University, Baltimore, MD, 21218-2689, USA

    R. R. Oberle & R. C. Cammarata

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  1. R. R. Oberle
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  2. R. C. Cammarata
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Oberle, R.R., Cammarata, R.C. Dependence of Hardness on Modulation Amplitude in Compositionally Modulated Cu−Ni Thin Films. MRS Online Proceedings Library 356, 369–372 (1994). https://doi.org/10.1557/PROC-356-369

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  • DOI: https://doi.org/10.1557/PROC-356-369

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