Abstract
An adhesive based interconnect design in which the contact force between a bumped die and substrate is maintained by the shrinkage stress of the adhesive was investigated for use in high performance applications. In general, heating will reduce the contact force because of the differential thermal expansions and load relaxation in the adhesive. Special experimental techniques have been developed to measure the relevant materials properties. The potential for optimization in terms of materials selection is discussed.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
K. Hatada, “A Direct Mounting of a 4000-pin LSI Chip Using a Photo-Hardening Resin”, Nikkei Microdevices (1987) pp. 107–115
K. Matsui, K. Utsumi, H. Ohkubo, and C. Sugitani, “Resin and Flexible Metal Bumps for Chip-on-Glass Technology”, Proc. 43rd Electronic Components & Technology Conf. (1989) pp. 205–210
P. B. Hogerton, J. B. Hall, J. M. Pujol, and R. S. Reylek, Mat. Res. Soc. Symp. Proc. 154 (1989) p. 145
M. Masuda, K. Sakuma, E. Satoh, Y. Yamasaki, H. Miyasaka, and J. Takeuchi, “Chip on Glass Technology for Large Capacity and High Resolution LCD”, Proc. Int. Electronic Manufacturing Technology Symp. (1989) pp. 57–60
T. Nukii, N. Kajimoto, H. Atarashi, H. Matsubara, K. Yamamura, and H. Matsui, “LSI Chip Mounting Technology for Liquid Crystal Displays”, Proc. Int. Symp. on Microelectronics (1990) pp. 257–262
N. R. Basavanhally, D. D. Chang, B. Cranston, and S. G. Segar, Jr., “Direct Chip Interconnect with Adhesive Conductor Films”, IEEE-CHMT 15 (1992) 972–976
D. D. Chang, P. A. Crawford, J. A. Fulton, R. McBride, M. B. Schmidt, R. E. Sinitski, and C. P. Wong, “An Overview and Evaluation of Anisotropically Conductive Adhesive Films for Fine Pitch Electronic Assembly”, Proc. 43rd Electronic Components & Technology Conf. (1993) 320–326
P. Børgesen, J. Dion, B. Yost, and C.-Y. Li, to be published
D. A. Lilienfeld, P. Børgesen, and C.-Y. Li, “A Damage Integral Based Analysis and Simulation of the Thermal Fatigue of Diebonds”, these proceedings
P. Børgesen, H. D. Conway, and C.-Y. Li, “Thermal Mismatch Induced Loading and Damage in Diebonds”, submitted to J. Electr. Pack.
C.-Y. Li, B. Yost, M.A. Korhonen, and J. Dion, “Micromechanical Testing of Electronic Packaging Components and Materials”, these proceedings
J. Dion, B. Yost, P. Børgesen, and C.-Y. Li, “Load Relaxation of Thin Polymer Adhesive”, in Proc. 1992 Joint ASME/JSME Conf. Electronic Pack. (W. T. Chen and H. Abe', eds., ASME, NY, 1992) 633–636
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Dion, J., Børgesen, P., Yost, B. et al. Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects. MRS Online Proceedings Library 323, 27–32 (1993). https://doi.org/10.1557/PROC-323-27
Published:
Issue Date:
DOI: https://doi.org/10.1557/PROC-323-27