Abstract
The interactions of Ti with SiO2, Si3N4, and SiOiNy have been studied during rapid thermal annealing at 400 to 900 °C in Ar with 3% H2 ambient. X-ray diffraction, sheet resistance measurements, RBS, nuclear reaction technique to profile hydrogen, and microscopy have been employed in this study. The results of this investigation indicate that Si3N4 and SiOxNy are more stable with Ti than SiO2.
Similar content being viewed by others
References
S. P. Murarka, Slicide for VLSI Applications. Academic Press New York 1983.
T. Brat, C. M. Osburn, T. Finstand, J. Liu, and B. Ellington, J. Electrochem. Soc, 133 1451 (1986).
S. P. Murarka, J. Vac. Sci. Tcchnol. B4 1325 (1986).
M. E. Alpcrin, T. C. Holloway, R. A. Hakcn, C. D. Gosmeyer, R. V. Karmaugh, and W. D. Parmantie, IEEE Trans, Electron Devies, ED-32 141 (1985).
S. P. Murarka, J. Vac. Sci. Technol., 17, 775 (1980).
W. A. Lanford, H. P. Trautvetter, J. F. Zicglcr, and J. Keller, Appl. Phys. Lett. 28 566 (1976)
C. T. Ming, M. Wittmer, S. S. Tyer, and S. B. Brodsky, J. Electrochem. Soc. 131 2934 (1984).
J. A. Taylor and S. B. Dcsu, J. Amcr. Ccrm. Soc. 72 1947 (1989).
A. E. Morgan, E. K. Broadbent, amd D. K. Sadana, Appl. Phys. Lett., 49 1236 (1986).
S. Q. Wang and J. W. Mayer. J. Appl. Phys., 67 2932 (1990).
R. Beyers, R. Sinclair and M. E. Thomas, J. Vac. Sci. Technol. B2 781 (1984).
Acknowledgements
Authors would like to thank Intel, SEMATECH, MRC, and NRL for supports of this work.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Ko, SH., Devashrajee, N.M., Murarka, S.P. et al. Reactions of Titanium Films with thin Silicon Dioxide, Nitride, and Oxynitride Films During Rapid Thermal Annealing. MRS Online Proceedings Library 260, 665–671 (1992). https://doi.org/10.1557/PROC-260-665
Published:
Issue Date:
DOI: https://doi.org/10.1557/PROC-260-665