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Application of Superplasticity in Solder Joints

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Abstract

The lifetime of non-compliant eutectic solder joints was improved by an order magnitude by rapid quenching. The quenching produces a fine equiaxed superplastic grain structure which lowers the stresses in the solder joints for the fatigue cycle strain range. Similarly, compliant J Bend and Gull wing joints, which last thousands of cycles, operate at lower stresses where superplastic deformation predominates.

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References

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Acknowledgement

The authors want to thank the Lawrence Berkeley Laboratory for making the substrates used for the solder joints; Vincent Shorts and Amir Mazloom for helping make the solder joints; Syed Husain for directing the construction of fatigue machine; Digital Equipment for sponsoring the research.

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Authors and Affiliations

  1. Digital Equipment Corporation, 10500 Ridgeview Court, Cupertino, CA, 95014, USA

    M. C. Shine & T. Massingill

  2. Digital Equipment Corporation, TWO, Tewksbury, MA, 01876, USA

    J. Seyyedi

  3. Lawrence Berkeley Laboratory, Department of Materials Science, University of California, Berkeley, CA, 94720, USA

    Z. Mei & J. W. Morris Jr

Authors
  1. M. C. Shine
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  2. J. Seyyedi
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  3. T. Massingill
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  4. Z. Mei
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  5. J. W. Morris Jr
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Shine, M.C., Seyyedi, J., Massingill, T. et al. Application of Superplasticity in Solder Joints. MRS Online Proceedings Library 203, 425–436 (1990). https://doi.org/10.1557/PROC-203-425

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  • DOI: https://doi.org/10.1557/PROC-203-425

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