Abstract
Undoped LPCVD polysilicon films deposited on thermal oxide and prepared under various process conditions have been investigated for their texture and stress characteristics. Pole figures measured by X-ray diffraction in reflection geometry were used to determine the orientation. distribution function which provides a quantitative description of the texture. Stresses were determined using wafer curvature measurements. Both texture and stress show substantial variation with deposition condition. Textures typically exhibit axial symmetry and appear to be correlated with the sign and magnitude of the stress. Under certain deposition conditions, the stress varies considerably along the tube, with the stress in the wafers at the upstream end being tensile and at the downstream end being compressive.
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References
T.I. Kamins, Polycrystalline Silicon for Integrated Circuit Applications, (Kluwer Academic Publishers, Boston, 1988).
R.T. Howe, J. Vacuum Sci. Tech. B, 6, 1809 (1988).
G. Harbeke, L. Krausbauer, E.F. Steigmeier, A.E. Widmer, H.F. Kappert, and G. Neugebauer, RCA Review, 44, 287 (1983).
T.I. Kamins, J. Manoliu, and R.N. Tucker, J. Appl. Phys., 43, 83 (1972).
L.S. Fan and R.S. Muller, in Proceedings of the 1988 IEEE Solid State Sensors and Actuators Workshop, Hilton Head, S.C. (1988), pp. 55–58.
H. Guckel, D.W. Bums, H.A.C. Tilmans, D.W. DeRoo, and C.R. Rutigliano, in Proceedings of the 1988 IEEE Solid State Sensors and Actuators Workshop, Hilton Head, S.C. (1988), pp. 96–99.
T.A. Lober, J. Huang, M.A. Schmidt, and S.D. Senturia, in Proceedings of the 1988 IEEE Solid State Sensors and Actuators Workshop, Hilton Head, S.C. (1988), pp. 92–95.
H.-J. Bunge, Texture Analysis in Materials Science, (Butterworths, London, 1982).
R.-J. Roe, J. Appl. Phys., 36, 2024 (1965).
R.-J. Roe, J. Appl. Phys., 37, 2069 (1966).
P.R. Morris and A.J. Heckler, Advances in X-Ray Analysis, 11, 454 (1968).
H.R. Wenk, M. Sintubin, J. Huang, G.C. Johnson, and R.T. Howe, J. Appl. Phys., 67, 572 (1990).
J.S. Kallend, U.F. Kocks, A.D. Rollett, and H.R. Wenk, “Practical Texture Analysis,” to appear as a Los Alamos National Laboratory Report (1990).
C.S. Barrett and T.B. Massalski, The Structure of Metals, (McGraw-Hill, New York, 1966).
R.W. Hoffman, in Physics of Thin Films, Vol. 3, ed. by G. Hass and T.E. Thun (Academic Press, New York, 1966) pp. 211–273.
J. Adamczewska and T. Budzynski, Thin Solid Films, 113, 271 (1984).
P. Joubert, B. Loisel, Y. Chouan, and L. Haji, J. Electrochem. Soc., 134, 2541 (1987).
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Huang, J., Krulevitch, P., Johnson, G. et al. Investigation of Texture and Stress in Undoped Polysilicon Films. MRS Online Proceedings Library 182, 201–206 (1990). https://doi.org/10.1557/PROC-182-201
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DOI: https://doi.org/10.1557/PROC-182-201