Abstract
During the manufacturing process of the BEOL the low-k brittle ILD dielectrics are exposed to wet environments. These environments could and do affect the films fracture toughness, the so called critical film thickness, above which spontaneous cracking occurs. Nanoindentation combined with AFM imaging methods allow to study these phenomena.
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Simonyi, E.E., Lane, M., Liniger, E. et al. Comparison of the Fracture Behavior of Brittle ILD Films used in the BEOL in Dry and Wet Environment using Nanoindentation. MRS Online Proceedings Library 914, 411 (2005). https://doi.org/10.1557/PROC-0914-F04-11
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DOI: https://doi.org/10.1557/PROC-0914-F04-11