Abstract
In this paper, a low-temperature surface micromachining module with two sacrificial layers of polyimide is developed for the manufacturing of double-cantilever microbolometer focal plane arrays. The use of spin-on polyimide allows an all-dry final release step overcoming stiction problems often encountered in wet sacrificial etching processes. For the patterning of the polyimide, a plasma-enhanced chemical vapor deposited silicon oxide is employed as a mask layer. Anisotropic etching of both the mask film and the polyimide layer is accomplished by reactive ion etching. After patterning structural layers, sacrificial etching of the polyimide is conducted using an isotropic dry etch process in high-density oxygen plasma.
Similar content being viewed by others
References
B. Li, Sens. Actuators A 112, 351 (2004).
B. Bhushan, J. Vac . Sci. Technol. B 21, 2262 (2003).
2000 PI2610 Data Sheet (Detroit, MI: H D Microsystems).
1997 VM-651 and VM-652 Data Sheet (Detroit, MI: H D Microsystems).
A. Bagolini, L. Pakula, T. LMScholtes, H. TMPham, P.J. French, and P. M Sarro, J. Micromech. Microeng. 12 385 (2002).
K.R. Williams, K. Gupta, and M. Wasilik, J. Microelectromech. S. 12 761 (2003).
J. Lai, Z. Shi, T. Perazzo, and A. Majumdar, Sens. Actuators 58 113 (1997).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Huang, S., Zhang, X. Application of polyimide sacrificial layers for the manufacturing of uncooled double-cantilever microbolometers. MRS Online Proceedings Library 890, 815 (2005). https://doi.org/10.1557/PROC-0890-Y08-15
Received:
Accepted:
Published:
DOI: https://doi.org/10.1557/PROC-0890-Y08-15