Abstract
This paper describes the key process steps in the low temperature, <300°C, formation of device quality Si/SiO2 interfaces employing oxide deposition by Remote Plasma-Enhanced Chemical Vapor-Deposition (Remote PECVD). The quality of the Si/SiO2 interface correlates with the degree of surface reconstruction that is controlled by ex-situ wet cleaning and in-situ Rapid Flash Heating. Electronic properties of the MOS structure also vary with the deposited oxide thickness, independent of the initial surface quality.
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Kim, S.S., Tsu, D.V., Lucovsky, G. et al. Formation of Device Quality Si/SiO2 Interfaces in a Multichamber Integrated Processing System. MRS Online Proceedings Library 146, 327–332 (1989). https://doi.org/10.1557/PROC-146-327
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DOI: https://doi.org/10.1557/PROC-146-327