Abstract
This paper represents a study of the local atomic structure of SiO2 films formed by thermal oxidation in dry oxygen, pyrolytic steam, and a variety of different sequences of these arabients. All oxidations were carried out at 850°C. Local atomic structure was studied via infrared spectroscopy (IR). The growth ambient dependence of the frequency v, and half-width Δv, of the bond stretching feature, and the refractive index, n, was investigated. Consistent with previous work [1,2] it was found that when the majority of the sample thickness was grown in steam the oxides were generally less dense than dry oxides. Also, the last ambient in a sequential oxidation process was found to have the most influence on the oxide properties. The observed variations in v, Δv, and n could be readily explained in terms of systematic changes in the bond angle at the oxygen bonding site between corner connected tetrahedra.
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References
J.T. Fitch and G. Lucovsky, Proc. MRS, Vol. 92, Rapid Thermal Processing of Electronic Materials, p. 89.
J.T. Fitch and G. Lucovsky, AVS Fall Meeting, Anahiem, CA, 2-6 November 1987.
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Fitch, J.T., Lucovsky, G. The Effect of Growth Ambients on the Local Atomic Structure of Thermally Grown Silicon Dioxide Thin Films. MRS Online Proceedings Library 105, 151–156 (1987). https://doi.org/10.1557/PROC-105-151
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DOI: https://doi.org/10.1557/PROC-105-151