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Micron diamond composites with nanocrystalline silicon carbide bonding

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Abstract

Diamond composites with nanocrystalline cubic silicon carbide bonding were sintered from diamond/amorphous silicon mixtures under high pressure and high temperature (p = 5 GPa and temperatures up to 1673 K). Differential scanning calorimetry, ex situ x-ray, and Raman spectroscopy investigations showed that amorphous silicon partially transformed into nanocrystalline silicon at 873 K under 5 GPa. This was followed by the formation of nanocrystalline silicon carbide from the reaction between the silicon and diamond after silicon melting. Refinement of the x-ray diffraction patterns of composites with the Rietveld method revealed that considerable microstrain (0.3–0.5%) remained within the nanocrystalline silicon carbide grains. Small strain (0.1–0.2%) was observed in the compacted diamonds, but after the reaction they became almost strain free (<0.1%). Enhanced fracture toughness was obtained for hybrid composites compared to liquid-infiltrated composites.

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Authors and Affiliations

  1. Texas Christian University, Physics and Astronomy Department, 76129, Fort Worth, Texas, USA

    J. Qian Jr. & T. W. Zerda

  2. Neutron Scattering Center, MS-H805, Los Alamos National Laboratory, Los Alamos, Mexico

    J. Qian Jr.

  3. Neutron Scattering Center, Los Alamos National Laboratory, MS-H805, 87545, Manuel Lujan, Los Alamos, Mexico

    D. He, L. Daemen & Y. Zhao Jr.

Authors
  1. J. Qian Jr.
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  2. T. W. Zerda
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  3. D. He
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  4. L. Daemen
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  5. Y. Zhao Jr.
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Correspondence to J. Qian Jr..

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Qian, J., Zerda, T.W., He, D. et al. Micron diamond composites with nanocrystalline silicon carbide bonding. Journal of Materials Research 18, 1173–1178 (2003). https://doi.org/10.1557/JMR.2003.0161

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  • DOI: https://doi.org/10.1557/JMR.2003.0161

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