Abstract
The internal stress and internal friction of electrodeposited multilayered Cu–Ni(100) thin films were investigated as a function of temperature by a sensitive vibrating membrane technique. Each membrane was in a state of biaxial stress (approaching the yield strength) resulting from contributions of the growth stress in the as-deposited film and from the thermal stress as the membrane was heated. The measured internal friction of these stressed multilayered films was enhanced by over an order of magnitude compared to the predicted value of classic damping related to the modulus defect when the effect of the internal stress was taken into account.
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Oberle, R.R., Cammarata, R.C., Su, C.M. et al. Internal friction of artificially multilayered Cu–Ni(100) membranes produced by electrodeposition. Journal of Materials Research 14, 3837–3839 (1999). https://doi.org/10.1557/JMR.1999.0517
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DOI: https://doi.org/10.1557/JMR.1999.0517