Abstract
A low-temperature (>450 °C) thermal chemical vapor deposition (CVD) process was developed for the growth of TaNx from the reaction of tantalum pentabromide, ammonia, and hydrogen. Studies of process reaction kinetics yielded two sequential rate-controlling steps, with an activation energy of 0.45 eV for the kinetically limited reaction regime. Additionally, a systematic design of experiments approach examined the effects of key process parameters, namely, substrate temperature, source temperature, and hydrogen and ammonia flows, on film properties. A wide CVD process window was established for nitrogen-rich amorphous TaNx with contamination below 1 at.%. Film conformality was higher than 95% in nominally 0.30 μm, 4.5: 1 aspect ratio, trench structures.
Similar content being viewed by others
References
T. Nitta, T. Ohmi, S. Sakai, and T. Shibata, J. Electrochem. Soc. 140, 1131 (1993).
G. P. Rao, Multilevel Interconnect Technology (McGraw-Hill, Inc., New York, 1994).
M. Takeyama, A. Noya, T. Sase, and A. Ohta, J. Vac. Sci. Technol. B14, 674 (1996).
E. Kobeda, J. Warnock, J. Gambino, S. Brosky, and S. Basavaiah, J. Appl. Phys. 72, 2743 (1992).
CRC Handbook of Chemistry and Physics, 71st ed., edited by J. Lide (CRC Press, Cleveland, OH, 1991), pp. 4–109.
J. S. Reid, E. Kolawa, and M. Nicolet, J. Mater. Res. 7, 2424 (1992).
K. Holloway, P. M. Fryer, C. Cabral, and P. J. Bailey, J. Appl. Phys. 71, 5433 (1992).
K. Hieber, Thin Solid Films 24, 157 (1974).
R. Fix, R. Gordon, and D. Hoffman, Chem. Mater. 5, 614 (1993).
H. Chiu and W. Chang, J. Mater. Sci. Lett. 11, 92 (1992).
M. Tsai, Appl. Phys. Lett. 67, 1129 (1995).
I. Barin, O. Knacke, and O. Kubaschewski, Thermochemical Properties of Inorganic Substances Supplement (Springer-Verlag, Berlin, Heidelberg, New York, 1977).
M. Seel and P. S. Bagus, Phys. Rev. B28, 2023 (1983).
C. Faltermeier, C. Goldberg, M. Jones, A. Upham, D. Manger, G. Peterson, J. Lau, and A. Kaloyeros, J. Electronchem. Soc. 144, 1002 (1997).
See, for example, A. Knorr, R. Talevi, H. Gundlach, K. A. Kumar, G. P. Peterson, A. E. Kaloyeros, J.J. Sullivan, and J. Loan, J. Vac. Sci. Technol. B15, 1758 (1997); and X. Chen, Tantalum and Tantalum Nitride Films Grown by Inorganic Low Temperature Chemical Vapor Deposition for Copper Metallization: Chemistry, Process, and Material Development and Characterization (Doctoral Thesis, The University at Albany–SUNY Press, Albany, New York, 1998).
J. Moulder, W. Stickle, P. Sobol, and K. Bomken, Perkin-Elmer Corporation, Eden Prairie, MN (1992).
L. Toth, Transition Metal Carbides and Nitrides (Academic Press, New York, 1971), p. 188.
S.P. Murarka, Metallization: Theory and Practice for VLSI and ULSI (Butterworth-Heinemann, March 1993).
The National Technology Roadmap for Semiconductors (Semiconductor Research Association, San Jose, CA, 1997), pp. 99–113.
A. Yajima, R. Matsuzaki, and Y. Saeki, Denki Kagaku 51, 676 (1983).
X. Chen, G.G. Peterson, G. Nuesca, H.L. Frisch, A. E. Kaloyeros, and B. Arkles, unpublished.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Chen, X., Peterson, G.G., Goldberg, C. et al. Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications. Journal of Materials Research 14, 2043–2052 (1999). https://doi.org/10.1557/JMR.1999.0276
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.1999.0276