Abstract
The growth of tin whiskers formed on sputtered tin layers deposited on brass was studied using electron microscopy. The occurrence of whiskers appeared to be largely independent of the macroscopic stress state in the film; rather it was microscopic compressive stresses arising from the formation of an intermetallic phase that appeared to be the necessary precursor. Whisker morphology was a result of whether nucleation had occurred on single grains or on multiple grains. In the latter case, the whiskers had a fluted or striated surface. The formation of whiskers on electron transparent samples was demonstrated. These samples showed the whiskers were monocrystalline and defect free, and that the growth direction could be determined.
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LeBret, J.B., Norton, M.G. Electron microscopy study of tin whisker growth. Journal of Materials Research 18, 585–593 (2003). https://doi.org/10.1557/JMR.2003.0076
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DOI: https://doi.org/10.1557/JMR.2003.0076