Effect of Hydrogen Plasma on Electroless-Plating Ni–B Films and Its Cu Diffusion Barrier Property
Electroless-plating Ni–B films have been evaluated for the application as the diffusion barrier and metal cap for copper integration. The effect of post plasma treatment in a hydrogen environment on the characteristics of Ni–B films such as chemical composition, surface
roughness, crystallinity, and resistivity was investigated. By treating electroless-plating Ni–B films with H2 plasma, the resistance and the roughness of the films decreased. The leakage current of Ni–B bottom electrode/30-nmthick Al2O3/Al top
electrode structures improved after the H2 plasma treatment on the Ni–B films. 40 nm-thick electroless-plating Ni–B film was able to block Cu diffusion up to 350 °C.
Document Type: Research Article
Publication date: 01 December 2014
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