Abstract
In today's semiconductor market of the growing automotive industry, reliability of the devices becomes a major concern as all these devices require an extremely low stress and high thermal condition. This paper will discuss the critical characteristics that are responsible for the die top corner delamination and focuses mainly on a few key areas such as molding compound, wafer and plasma cleaning process so as to enable the achievable of reliable and robust package for automotive products. The devices are to be characterized with scanning acoustic tomography (SAT) and various package level reliability tests. From the study, it has been found that plasma cleaning process plays an important role in resolving the reliability issue by totally eliminating die top corner delamination, and which has improved tremendously in the life span of the devices and also the reliability of the packages.