Abstract
The goal of this paper is to measure the electrical and thermal conductivity variations with temperature in the unidirectional solidified quaternary Sn–Bi–In–Zn lead-free solder alloys for nine different compositions to determine the phonon thermal conductivity variation with temperature. The measurements of electrical and thermal conductivity variations with temperature were put into practice with the methods of four-point probe and longitudinal heat flow, respectively, and the electron and phonon thermal conductivity variations with temperature for the alloys were plotted. In addition, the temperature coefficient values for electrical and thermal conductivity were calculated.
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REFERENCES
Y. S. Touloukian, R. W. Powell, C. Y. Ho, and P. G. Klemens, Thermal Conductivity Metallic Elements and Alloys (New York, 1970).
https://www.thebalance.com/electrical–conductivity–in–metals–2340117.
F. Meydaneri, B. Saatçi, and M. Ari, “Thermoelectrical characterization of lead–cadmium (Pb–Cd) Alloys,” Int. J. Phys. Sci. 7, 6210–6221 (2012).
V. Rudnev, D. Loveless, R. Cook, and M. Black, Handbook of Induction Heating (Markel Dekker, New York, 2003), pp. 119–120.
http://www.engineeringtoolbox.com/thermal–conductivity–metals–d_858.html.
http://global.kyocera.com/fcworld/charact/heat/thermalcond.html.
K. J. Puttlitz and K. A. Stalter, Hand Book of Led–Free Solder Technology for Microelectronic Assemblies (IMB Corporation, New York, 2004).
M. H. Braga, J. Vizdal, A. Kroupa, J. Ferreira, D. Soares, and L. F. Malheiros, “The experimental study of the Bi–Sn, Bi–Zn and Bi–Sn–Zn systems,” CALPHAD 31, 468–478 (2007).
W. Yang, R. W. Messler Jr, and L. E. Felton, “Microstructure evolution of eutectic Sn–Ag solder joints,” J. Electron. Mater. 23, 765–772 (1994).
S. Cheng, C–M. Huang, and M. Pecht, “A review of lead–free solders for electronics applications,” Microelectron. Reliab. 75, 77–95 (2017).
M. A. Faza, N. K. Liyana, S. Rubaiee, and A. Anas, “A critical review on performance, microstructure and corrosion resistance of Pb-free solders,” Measurement 134, 897–907(2019).
V. P. Osipenko, “Thermal conductivity of alloys of the systems Sn–Pb and Sn–In in the solid and liquid states,” Sov. Phys. J. 13, 1570–1573 (1970).
S. W. Yoon, R.J. Soh, H. M. Lee, and B. J. Lee, “Thermodynamics–aided alloy design and evaluation of Pb–free solder Sn–Bi–In–Zn system,” Acta Metall. 45, 951–960 (1997).
S. Aksöz, E. Öztürk, and N. Maraşlı, “The measurement of thermal conductivity variation with temperature for solid materials,” Measurement 46, 161–170 (2013)
M. Demir, S. Aksöz, E. Öztürk, and N. Maraşlı, “The measurement of thermal conductivity variation with temperature for lead–free solder alloys,” Metall. Mater. Trans. B 45, 1739–1749 (2014).
N. Aksöz, E. Öztürk, Ü. Bayram, S. Aksöz, S. Kervan, A. Ülgen, and N. Maraşlı, “The measurement of thermal conductivity variation with temperature for lead− free ternary eutectic solders,” J Electron. Mater. 42, 3573–3581 (2013).
Y. Altıntas, Y. Kaygısız, E. Öztürk, S. Aksöz, K. Keşlioğlu, and N. Maraşlı, “The measurements of electrical and thermal conductivity variations with temperature and phonon component of the thermal conductivity in the Sn–Cd–Sb, Sn–In–Cu, Sn–Ag–Bi and Sn–Bi–Zn alloys”, Int. J. Therm. Sci. 100, 1–9 (2016).
J.-Y. Yang, W. Zhang, C. Xu, J. Liu, L. Liu, and M. Hu, ”Strong electron–phonon coupling induced anomalous phonon transport in ultrahigh temperature ceramics ZrB2 and TiB2,” Int. J. Heat Mass Transfer 152, 119481 (2020).
A. Giri, M. V. Tokina, O. V. Prezhdo, and P. E. Hopkins, “Electronephonon coupling and related transport properties of metals and intermetallic alloys from first principles,” Mater. Today Phys. 12, 100175 (2020).
E. Çadırlı U. Böyük, H. Kaya, and N. Maraşlı, “Determination of mechanical, electrical and thermal properties of the Sn–Bi–Zn ternary alloy,” J. Non-Cryst. Solids 357, 2876–2881 (2011).
E Çadırlı, U. Böyük, H. Kaya, N. Maraşlı, S. Aksöz, and Y. Ocak, “Dependency of electrical properties on the temperature and composition of Sn in the directionally solidified Pb–Sn solders alloys,” J. Electron. Mater. 40 195–200 (2011).
L. B. Valder, “Resistivity measurements on germanium for transistors,” Proc. IRE 42, 420–427 (1954).
D. E. Gray, American Institute of Physics Handbook, (McGraw–Hill, New York, 1957).
N. C. Lee, J. A. Slattery, J. R. Sovinsky, I. Artaki, and P. T. Vianco, “A novel lead-free solder replacement,” Circ. Assem. 6, 36–44 (1995).
E. A. Brandes, Smithells Metals Reference Book, 6th ed. (Butterworths, London, 1983).
Y. Ocak, S. Aksöz, N. Maraşlı, and K. Keşlioğlu, “Experimental determination of thermal conductivity and solid–liquid interfacial energy of solid Ag3Sn intermetallic in the Sn–Ag–In ternary alloy,” Intermetallics 18, 2250–2258 (2010).
T. Gancarz, P. Fima, and J. Pstrus, “Thermal expansion, electrical resistivity and spreading area of Sn–Zn–In alloys,” J. Mater. Eng. Perform. 23, 1524–1529 (2014).
J. P. Srivastana, Elements of Solid State Physics (Prentice Hall of Indian, 2006).
W. F. Gale and T. C. Totemeier, Smithells Metals Reference Book, ed. 8 (Elsevier, Butterworth–Heinemann, 2004).
A. Jain and A. J. H. Mc Gaughey, “Thermal transport by phonons and electrons in aluminium, silver, and gold from first principles,” Phys. Rev. B 93, 081206R1-5 (2016).
Funding
The funding of this work has provided by TÜBİTAK under Contract no. 116F010. The researchers thank to TÜBİTAK Research Foundation for their funding.
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Pınar Ata Esener, Aksöz, S., Öztürk, E. et al. The Variations of Electron and Phonon Contributions to the Thermal Conductivity with Temperature in the Sn–Bi–In–Zn Alternative Lead-Free Solder Alloys. Phys. Metals Metallogr. 121, 1365–1374 (2020). https://doi.org/10.1134/S0031918X20140082
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DOI: https://doi.org/10.1134/S0031918X20140082