Abstract
Epoxide adhesive materials of cold setting developed at OAO Kompozit are presented. It is shown that all the materials have low gas evolution and high thermal conductivity and provide products of aerospace engineering with the mode of thermal control.
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Original Russian Text © S.N. Gladkikh, N.N. Vekshin, E.V. Kolesnikova, I.V. Tkachenko, T.N. Dreval’, 2012, published in Klei. Germetiki. Tekhnologii, 2012, No. 4, pp. 15–20.
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Gladkikh, S.N., Vekshin, N.N., Kolesnikova, E.V. et al. Design of epoxide adhesive and sealing materials with high thermal conductivity. Polym. Sci. Ser. D 5, 300–304 (2012). https://doi.org/10.1134/S1995421212040077
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DOI: https://doi.org/10.1134/S1995421212040077