Patterning conventional photoresists in environmentally friendly silicone fluids

Christine Y. Ouyang; Jin-Kyun Lee; Marie Krysak; Christopher K. Ober

doi:10.1117/12.879294

15 April 2011 Patterning conventional photoresists in environmentally friendly silicone fluids

Christine Y. Ouyang, Jin-Kyun Lee, Marie Krysak, Christopher K. Ober

Proceedings Volume 7972, Advances in Resist Materials and Processing Technology XXVIII; 79720O (2011) https://doi.org/10.1117/12.879294
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

The chemical waste generated in today's microelectronic fabrication process can be released into the environment and cause environmental and health concerns. It is therefore necessary to develop an environmentally friendly process that can eliminate the use of toxic chemical solvents. Silicone fluids are linear methyl siloxanes that only contain carbon, hydrogen, oxygen and silicon. They are low in toxicity, not ozone-depleting and contribute little to global warming. They degrade into naturally occurring compounds instead of accumulating in the atmosphere and can be recycled. Their unique physical and chemical properties have also made them promising developers for lithography. For example, their low surface tension can eliminate pattern collapse problems associated with high aspect-ratio features. Silicone fluids are non-polar solvents and their solvent strength is weaker than that of saturated hydrocarbons but stronger than that of the commercially available saturated hydrofluorocarbons and may be enhanced by adding other solvents. Two conventional photoresists used in this study, PBOCST and ESCAP are both insoluble in silicone fluids before or after exposure. However, the solubility of PBOCST and ESCAP in silicone fluids can be increased by using a silicon-containing additive. In this paper, we demonstrate this novel and environmentally friendly development of conventional photoresists in silicone fluids.

Citation Download Citation

Christine Y. Ouyang, Jin-Kyun Lee, Marie Krysak, and Christopher K. Ober "Patterning conventional photoresists in environmentally friendly silicone fluids", Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 79720O (15 April 2011); https://doi.org/10.1117/12.879294

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