Revolutionary innovation in system interconnection: a new era for the IC

Muhannad S. Bakir; Paragkumar A. Thadesar; Calvin King; Jesal Zaveri; Hyung Suk Yang; Chaoqi Zhang; Yue Zhang

doi:10.1117/12.876823

11 February 2011 Revolutionary innovation in system interconnection: a new era for the IC

Muhannad S. Bakir, Paragkumar A. Thadesar, Calvin King, Jesal Zaveri, Hyung Suk Yang, Chaoqi Zhang, Yue Zhang

Proceedings Volume 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X; 792803 (2011) https://doi.org/10.1117/12.876823
Event: SPIE MOEMS-MEMS, 2011, San Francisco, California, United States

Abstract

This paper describes novel microscale electrical, optical, and fluidic interconnect networks to address off-chip interconnect challenges in high-performance computing systems as well as to enable 3D heterogeneous integration of CMOS and MEMS/sensors.

Citation Download Citation

Muhannad S. Bakir, Paragkumar A. Thadesar, Calvin King, Jesal Zaveri, Hyung Suk Yang, Chaoqi Zhang, and Yue Zhang "Revolutionary innovation in system interconnection: a new era for the IC", Proc. SPIE 7928, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X, 792803 (11 February 2011); https://doi.org/10.1117/12.876823

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