Porosity characteristics of ultra-low dielectric insulator films directly patterned by nano-imprint lithography

Hyun Wook Ro; Ronald L. Jones; Huagen Peng; Hae-Jeong Lee; Eric K. Lin; Alamgir Karim; Do Y. Yoon; David W. Gidley; Christopher L. Soles

doi:10.1117/12.773004

28 March 2008 Porosity characteristics of ultra-low dielectric insulator films directly patterned by nano-imprint lithography

Hyun Wook Ro, Ronald L. Jones, Huagen Peng, Hae-Jeong Lee, Eric K. Lin, Alamgir Karim, Do Y. Yoon, David W. Gidley, Christopher L. Soles

Author Affiliations +

Proceedings Volume 6921, Emerging Lithographic Technologies XII; 69211M (2008) https://doi.org/10.1117/12.773004
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

Direct patterning of low-dielectric constant (low-k) materials via nanoimprint lithography (NIL) has the potential to simplify fabrication processes and significantly reduce the manufacturing costs for semiconductor devices. We report direct imprinting of sub-100 nm features into a high modulus methylsilsesquioxane-based organosilicate glass (OSG) material. An excellent fidelity of the pattern transfer process is quantified with nm precision using critical dimension small angle X-ray scattering (CD-SAXS) and specular X-ray reflectivity (SXR). X-ray porosimetry (XRP) and positron annihilation lifetime spectroscopy (PALS) measurements indicate that imprinting increases the inherent microporosity of the methylsilsequioxane-based OSG material. When a porogen (pore generating material) is added, imprinting decreases the population of mesopores associated with the porogen while retaining the enhanced microporosity. The net effect is a decrease the pore interconnectivity. There is also evidence for a sealing effect that is interpreted as an imprint induced dense skin at the surface of the porous pattern.

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Hyun Wook Ro, Ronald L. Jones, Huagen Peng, Hae-Jeong Lee, Eric K. Lin, Alamgir Karim, Do Y. Yoon, David W. Gidley, and Christopher L. Soles "Porosity characteristics of ultra-low dielectric insulator films directly patterned by nano-imprint lithography", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69211M (28 March 2008); https://doi.org/10.1117/12.773004

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