Microjet printing of high-precision microlens array for packaging of fiber optic components

Ting Chen; Weldon Royall Cox; Diana Lenhard; Donald J. Hayes

doi:10.1117/12.469561

3 June 2002 Microjet printing of high-precision microlens array for packaging of fiber optic components

Ting Chen, Weldon Royall Cox, Diana Lenhard, Donald J. Hayes

Proceedings Volume 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging; (2002) https://doi.org/10.1117/12.469561
Event: Symposium on Integrated Optoelectronic Devices, 2002, San Jose, California, United States

Abstract

A significant advance in technical capability has recently been achieved in the fabrication of refractive microlens arrays by microjet printing. This advance enables control of lens diameter and center-to-center distances to accuracies on the order of +/- 1 micrometers , and of focal length variations within an array to less than the +/- 1%. Such accuracies are especially important for microlens arrays used for MOEMs device interconnects to optical fibers because of the relatively long free space optical path lengths required for such applications. The new process also enables the printing of microlenses of a given diameter with aspect ratios and focal lengths varying over a wide range (e.g., f/1-f/5). The profile of plano-convex microlenses printed by this method have exhibited less than a quarter wavelength of deviation from spherical surface. The thermal durability of the optical epoxies used for microlens printing enables both cycling temperature up to 200 degree(s)C and continuous exposure to thousands of hours at 85 degree(s)C, without affecting microlens performance. The microjet printing of lensed fibers provides another solution for fiber beam shaping and collimation with low production cost.

Citation Download Citation

Ting Chen, Weldon Royall Cox, Diana Lenhard, and Donald J. Hayes "Microjet printing of high-precision microlens array for packaging of fiber optic components", Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); https://doi.org/10.1117/12.469561

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available