Environmental effects on the dimensions of SL5195 resin

The effect of humidity, temperature and temperature ramping rate on the dimensional changes of the photo‐cured stereolithography (SL) resin SL5195 was investigated. It was found that moisture absorption by the SL resin is a very slow process at ambient temperatures. Varying relative humidity (RH) between 20 and 90 per cent in the environment only produced slight changes in the sample dimensions during the time period investigated. Increasing the environment temperature caused a significant increase in the sample dimensions through thermal expansion along with accelerated moisture absorption at 50 per cent or higher RH. Increasing the temperature ramping rate reduces the moisture absorption during the thermal cycles.