Measurement of contact-line dissipation in a nanometer-thin soap film

Shuo Guo, Chun Huen Lee, Ping Sheng, and Penger Tong
Phys. Rev. E 91, 012404 – Published 14 January 2015

Abstract

We report a direct measurement of the friction coefficient ξc of two fluctuating contact lines formed on a fiber surface when a long glass fiber intersects the two water-air interfaces of a thin soap film. The glass fiber of diameter d in the range of 0.4–4 μm and length 100–300 μm is glued onto the front end of a rectangular cantilever used for atomic force microscopy. As a sensitive mechanical resonator, the hanging fiber probe can accurately measure a minute change of its viscous damping caused by the soap film. By measuring the broadening of the resonant peak of the hanging fiber probe with varying viscosity η of the soap film and different surface treatments of the glass fiber, we confirm that the contact line dissipation obeys a universal scaling law, ξc=απdη, where the coefficient α=1.1±0.3 is insensitive to the change of liquid-solid contact angle. The experimental result is in good agreement with the numerical result based on the phase field model under the generalized Navier boundary conditions.

  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
  • Figure
1 More
  • Received 17 September 2014

DOI:https://doi.org/10.1103/PhysRevE.91.012404

©2015 American Physical Society

Authors & Affiliations

Shuo Guo, Chun Huen Lee, Ping Sheng, and Penger Tong*

  • Department of Physics, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

  • *penger@ust.hk

Article Text (Subscription Required)

Click to Expand

References (Subscription Required)

Click to Expand
Issue

Vol. 91, Iss. 1 — January 2015

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review E

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×