Effect of hole doping in LixCu1xO

X. G. Zheng, H. Yamada, Daniel J. Scanderbeg, M. Brian Maple, and C. N. Xu
Phys. Rev. B 67, 214516 – Published 19 June 2003
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Abstract

A comprehensive study of the effect of hole doping on cupric oxide CuO, which may be an important reference compound for copper oxide superconductors, is done by experiments on the structural, transport conduction, and magnetic susceptibility properties of Cu1xLixO. With a conventional solid-state reaction process for sample preparation, lithium is found to substitute copper up to x=1.7%. This small quantity of substitution substantially brings out changes in crystal structure, transport conduction, and magnetic transition. With 1.7% Li substitution, the resistivity and activation energy decrease in orders of magnitude, the antiferromagnetic transition temperatures decrease from TN1=229K, TN2=213K to TN1=206K, TN2=199K, respectively, and the lattice constants show contrasting anisotropic changes. While the substitution of Cu by Li decreases the unit cell volume, it remarkably increases the Cu-Cu distance along the superexchange direction [101¯]. The relatively large decrement in TN is consistently explained by the weakened quasi-one-dimensional superexchange coupling along [101¯].

  • Received 23 January 2003

DOI:https://doi.org/10.1103/PhysRevB.67.214516

©2003 American Physical Society

Authors & Affiliations

X. G. Zheng1,2,*, H. Yamada5, Daniel J. Scanderbeg2, M. Brian Maple2,3, and C. N. Xu4,5

  • 1Department of Physics, Saga University, Saga 840-8502, Japan
  • 2Institute for Pure and Applied Physical Sciences, University of California, San Diego, California 92093-0360, USA
  • 3Department of Physics, University of California, San Diego, California 92093-0319, USA
  • 4National Institute of Advanced Industrial Science and Technology, AIST, Kyushu, Tosu, Saga 841-0052, Japan
  • 5PRESTO, Japan Science and Technology Corporation (JST), Honcho, Kawaguchi, Saitama 332-0012, Japan

  • *Author to whom correspondence should be addressed. Email address: zheng@cc.saga-u.ac.jp

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Vol. 67, Iss. 21 — 1 June 2003

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