Cross-plane thermal conductivity of self-assembled Ge quantum dot superlattices

J. L. Liu, A. Khitun, K. L. Wang, W. L. Liu, G. Chen, Q. H. Xie, and S. G. Thomas
Phys. Rev. B 67, 165333 – Published 30 April 2003
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Abstract

We report the temperature dependent cross-plane thermal conductivities of Ge quantum dot superlattices measured by the 3ω method. A large reduction in the thermal conductivity of the superlattices compared with that of bulk materials is observed. A simple model taking into account the relaxation time approximation, including phonon scattering on quantum dots, well explains the experimental data.

  • Received 9 December 2002

DOI:https://doi.org/10.1103/PhysRevB.67.165333

©2003 American Physical Society

Authors & Affiliations

J. L. Liu*

  • Department of Electrical Engineering, University of California at Riverside, Riverside, California 92521

A. Khitun and K. L. Wang

  • Device Research Laboratory, Department of Electrical Engineering, University of California at Los Angeles, Los Angeles, California 90095-1594

W. L. Liu

  • Nanoscale Heat Transfer and Thermoelectrics Laboratory, Mechanical and Aerospace Engineering Department, University of California at Los Angeles, Los Angeles, California 90095-1594

G. Chen

  • Mechanical Engineering Department, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139

Q. H. Xie

  • Process and Materials Characterization Laboratory, Digital DNA Laboratories, Motorola, 2100 E. Elliot Rd., Tempe, Arizona 85284

S. G. Thomas

  • Si RF/IF Technologies, Digital DNA Laboratories, Motorola, 2100 E. Elliot Rd., Tempe, Arizona 85284

  • *Email address: jianlin@ee.ucr.edu

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Vol. 67, Iss. 16 — 15 April 2003

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