High-angle grain-boundary junctions in YBa2Cu3O7: Normal-state resistance and 1/f noise

Li Liu, E. R. Nowak, H. M. Jaeger, B. V. Vuchic, K. L. Merkle, D. B. Buchholz, and R. P. H. Chang
Phys. Rev. B 51, 16164 – Published 1 June 1995
PDFExport Citation

Abstract

We have investigated the normal-state resistance and the excess low-frequency (1/f) noise in 45° tilt [001] grain-boundary junctions in YBa2Cu3O7 thin films. A characteristic temperature dependence of the resistance fluctuations and a linear temperature dependence of the grain-boundary resistance (with a negative temperature coefficient) emerge as common features. These observations are quantitatively compared with a model of many, parallel conduction paths across the boundary, taking into account both temperature-independent and thermally activated transport processes.

  • Received 11 August 1994

DOI:https://doi.org/10.1103/PhysRevB.51.16164

©1995 American Physical Society

Authors & Affiliations

Li Liu, E. R. Nowak, and H. M. Jaeger

  • James Franck Institute and Department of Physics, The University of Chicago, Chicago, Illinois 60637

B. V. Vuchic and K. L. Merkle

  • Materials Science Division, Argonne National Laboratory, Argonne, Ilinois 60439

D. B. Buchholz and R. P. H. Chang

  • Department of Material Science and Engineering, Northwestern University, Evanston, Illinois 60208

References (Subscription Required)

Click to Expand
Issue

Vol. 51, Iss. 22 — 1 June 1995

Reuse & Permissions
Access Options
Author publication services for translation and copyediting assistance advertisement

Authorization Required


×
×

Images

×

Sign up to receive regular email alerts from Physical Review B

Log In

Cancel
×

Search


Article Lookup

Paste a citation or DOI

Enter a citation
×