Ablation of Submicrometer Holes Using an Extreme-Ultraviolet Laser

Andrew K. Rossall, Valentin Aslanyan, Greg J. Tallents, Ilya Kuznetsov, Jorge J. Rocca, and Carmen S. Menoni
Phys. Rev. Applied 3, 064013 – Published 19 June 2015

Abstract

Simulations and experiments are used to study extreme-ultraviolet (EUV) laser drilling of submicrometer holes. The ablation process is studied with a 2D Eulerian hydrodynamic code that includes bound-free absorption processes relevant to the interaction of EUV lasers with a solid material. Good agreement is observed between the simulated and measured ablated depths for on-target irradiances of up to 1×1010Wcm2. An increase in the irradiance to 1×1012Wcm2 is predicted to ablate material to a depth of 3.8μm from a single pulse with a hole diameter 3 to 4 times larger than the focal spot size. The model allows for the simulation of the interaction of a laser pulse with the crater created by a previous shot. Multiple-pulse lower-fluence irradiation configurations under optimized focusing conditions, i.e., approaching the diffraction limit, are shown to be advantageous for applications requiring mesoscale [(100nm)(1μm)] features and a high level of control over the ablation profile.

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  • Received 10 March 2015

DOI:https://doi.org/10.1103/PhysRevApplied.3.064013

© 2015 American Physical Society

Authors & Affiliations

Andrew K. Rossall*, Valentin Aslanyan, and Greg J. Tallents

  • York Plasma Institute, University of York, Heslington, York YO10 5DD, United Kingdom

Ilya Kuznetsov, Jorge J. Rocca, and Carmen S. Menoni

  • Centre for Extreme Ultraviolet Science and Technology and Department of Electrical and Computer Engineering, Colorado State University, Fort Collins, Colorado 80523, USA

  • *andrew.rossall@york.ac.uk

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Vol. 3, Iss. 6 — June 2015

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