Linear Aging Behavior at Short Timescales in Nanoscale Contacts

Kaiwen Tian, Zhuohan Li, Yun Liu, Nitya N. Gosvami, David L. Goldsby, Izabela Szlufarska, and Robert W. Carpick
Phys. Rev. Lett. 124, 026801 – Published 16 January 2020
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Abstract

Nanoscale silica-silica contacts were recently found to exhibit logarithmic aging for times ranging from 0.1 to 100 s, consistent with the macroscopic rate and state friction laws and several other aging processes. Nanoscale aging in this system is attributed to progressive formation of interfacial siloxane bonds between surface silanol groups. However, understanding or even data for contact behavior for aging times <0.1s, before the onset of logarithmic aging, is limited. Using a combination of atomic force microscopy experiments and kinetic Monte Carlo simulations, we find that aging is nearly linear with aging time at short timescales between 5 and 90 ms. We demonstrate that aging at these timescales requires the existence of a particular range of reaction energy barriers for interfacial bonding. Specifically, linear aging behavior consistent with experiments requires a narrow peak close to the upper bound of this range of barriers. These new insights into the reaction kinetics of interfacial bonding in nanoscale aging advance the development of physically based rate and state friction laws for nanoscale contacts.

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  • Received 30 May 2019

DOI:https://doi.org/10.1103/PhysRevLett.124.026801

© 2020 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Kaiwen Tian1,†, Zhuohan Li2,†, Yun Liu3,‡, Nitya N. Gosvami4,¶, David L. Goldsby5, Izabela Szlufarska2, and Robert W. Carpick4,*

  • 1Department of Physics and Astronomy, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA
  • 2Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA
  • 3Department of Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts 02138, USA
  • 4Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA
  • 5Department of Earth and Environmental Science, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA

  • *Corresponding author. carpick@seas.upenn.edu
  • K. T. and Z. L. contributed equally to this work.
  • Present address: Apple Inc., Cupertino, California 95014, USA.
  • Present address: Department of Materials Science and Engineering, IIT Delhi, Hauz Khas, New Delhi, Delhi 110016, India.

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Issue

Vol. 124, Iss. 2 — 17 January 2020

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