Self-templating growth of copper nanopearl-chain arrays in electrodeposition

Yu-Yan Weng, Bo Zhang, Shao-Jie Fu, Mu Wang, Ru-Wen Peng, Guo-Bin Ma, Da-Jun Shu, and Nai-Ben Ming
Phys. Rev. E 81, 051607 – Published 25 May 2010

Abstract

We report here a unique in-plane self-templating electrochemical growth of arrays of copper nanopearl chains from an ultrathin layer of CuSO4 electrolyte. Scanning electron microscopy indicates that the electrodeposit filaments form equally spaced bundles, which consist of long, straight, pearl-chain-like copper filaments with corrugated periodic structure. The bundle separation can be tuned by changing the applied electric current in electrodeposition. Experiments show that the periodic morphology on the nanopearl chain corresponds to the periodic distribution of copper and cuprous oxide. The mechanism for the bundle formation is discussed.

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  • Received 1 January 2010

DOI:https://doi.org/10.1103/PhysRevE.81.051607

©2010 American Physical Society

Authors & Affiliations

Yu-Yan Weng, Bo Zhang, Shao-Jie Fu, Mu Wang*, Ru-Wen Peng, Guo-Bin Ma, Da-Jun Shu, and Nai-Ben Ming

  • National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, Nanjing 210093, China

  • *Author to whom correspondence should be addressed; muwang@nju.edu.cn

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Vol. 81, Iss. 5 — May 2010

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