Effect of strain relaxations on heteroepitaxial metal-on-metal island nucleation and superlattice formation: Fe on Cu(111)

N. N. Negulyaev, V. S. Stepanyuk, L. Niebergall, P. Bruno, W. Auwärter, Y. Pennec, G. Jahnz, and J. V. Barth
Phys. Rev. B 79, 195411 – Published 12 May 2009

Abstract

Recent theoretical and experimental studies indicate that strain relaxations induced at a substrate can substantially affect the shape of nanostructures during thin-film epitaxy. We reveal the influence of strain relaxations on the self-ordering of Fe adatoms on Cu(111) during low-temperature submonolayer deposition by complementary experimental and theoretical investigations. Combining kinetic Monte Carlo and first-principles density-functional theory calculations, we study the interplay between surface nanostructuring and strain relaxations at the Cu substrate. The comparison of our theoretical results with scanning tunneling microscopy observations reveals marked effects on the adatom nucleation because of the substrate strain relief. The modified energy landscape around Fe adatoms and small close-packed Fe clusters at short distances (<6Å) opens up a slippage motion channel mediating the formation of iron dimers and compact aggregates.

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  • Received 3 February 2009

DOI:https://doi.org/10.1103/PhysRevB.79.195411

©2009 American Physical Society

Authors & Affiliations

N. N. Negulyaev1, V. S. Stepanyuk2, L. Niebergall2, P. Bruno2,3, W. Auwärter4,5, Y. Pennec4, G. Jahnz4, and J. V. Barth4,5

  • 1Fachbereich Physik, Martin-Luther-Universität, Halle-Wittenberg, Friedemann-Bach-Platz 6, D-06099 Halle, Germany
  • 2Max-Planck-Institut für Mikrostrukturphysik, Weinberg 2, D-06120 Halle, Germany
  • 3European Synchrotron Radiation Facility, BP 220, F-38043 Grenoble Cedex, France
  • 4Department of Physics and Astronomy, University of British Columbia, AMPEL 2355 East Mall, Vancouver, British Columbia, Canada V6T 1Z4
  • 5Physik Department E20, Technische Universität München, James-Franck-Str. 1, D-85748 Garching, Germany

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Issue

Vol. 79, Iss. 19 — 15 May 2009

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