Abstract
The influence of the morphology of oxidized copper nanoparticles on the deposition efficiency, packing density, and resistivity of microstructures obtained by dry aerosol printing was studied. It has been established that the thermal treatment of aerosol nanoparticles allows to vary their morphology from branched submicron agglomerates to compact spherical nanoparticles with a size of 20-50 nm. It is shown that the use of spherical nanoparticles in comparison with agglomerates allows one to obtain densely packed nanoparticles on substrate. Moreover, obtaining of semiconductor microstructures from oxidized copper nanoparticles on a plastic substrate with a resistivity of 0.01 Ohm • m was demonstrated.
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