A new analytical model for simulating resist heating in electron beam lithography

A new analytical model has been developed on the basis of a previous model (by Abe et al.) to simulate resist heating in electron beam lithography. Temperature distributions in both the resist and the substrate have been calculated for a single flash of a shaped beam and for a beam scanning a pattern, showing that the pattern size, the beam current density and the thermal conductivity of the substrate are key factors affecting the temperature rise in resist.