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High-gain differential CMOS transimpedance amplifier with on-chip buried double junction photodiode

High-gain differential CMOS transimpedance amplifier with on-chip buried double junction photodiode

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  • Author(s): W. Xu 1 ; D.L. Mathine 2 ; J.K. Barton 3
    • View affiliations
    • Affiliations: 1: Department of Systems and Industrial Engineering, The University of Arizona, Tucson, USA
      2: College of Optical Sciences, The University of Arizona, Tucson, USA
      3: Division of Biomedical Engineering, Department of Electrical and Computer Engineering, College of Optical Sciences, The University of Arizona, Tucson, USA
  • Source: Volume 42, Issue 14, 6 July 2006, p. 803 – 805
    DOI:  10.1049/el:20061560 , Print ISSN 0013-5194, Online ISSN 1350-911X
© The Institution of Engineering and Technology
Published

An integrated fully differential CMOS transimpedance amplifier (TIA) with buried double junction photodiode input is described. The TIA features a variable high transimpedance gain (250 kΩ to 2.5 MΩ), large DC photocurrent rejection capability (>55 dB) and low input referred noise density at 100 kHz (2pA/√Hz).

Inspec keywords: CMOS integrated circuits; differential amplifiers; photodiodes

Other keywords: noise density; buried double junction photodiode; differential CMOS transimpedance amplifier; DC photocurrent rejection capability

Subjects: Amplifiers; Photoelectric devices; CMOS integrated circuits

References

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      • Stehr, U., Henkel, F., Dallüge, L., Waldow, P.: `A fully differential CMOS integrated 4th order reconfigurable GM-C lowpass filter for mobile communication', IEEE Int. Conf. on Electronics, Circuits and Systems, 2003, p. 144–147.
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      • G.N. Lu , M.B. Chouikha , G. Sou , M. Sedjil . Colour detection using a buried double p-n junction structure implemented in the CMOS process. Electron. Lett. , 6 , 549 - 596
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      • Zand, B., Phang, K., Johns, D.A.: `A transimpedance amplifier with DC-coupled differential photodiode current sensing for wireless optical communications', Proc. IEEE Custom Integrated Circuits Conf., 2001, p. 455–458.
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