Issue 7, 2012
From the journal:

Physical Chemistry Chemical Physics

The electrodeposition of silver composites using deep eutectic solvents

Andrew P. Abbott,a   Khalid El Ttaib,a   Gero Frisch,*a   Karl S. Rydera  and  David Westonb  

* Corresponding authors

a Department of Chemistry, University of Leicester, Leicester LE1 7RH, UK
E-mail: gero.frisch@leicester.ac.uk

b Department of Engineering, University of Leicester, Leicester LE1 7RH, UK

Abstract

Silver is an important metal for electronic connectors, however, it is extremely soft and wear can be a significant issue. This paper describes how improved wear resistant silver coatings can be obtained from the electrolytic deposition of silver from a solution of AgCl in an ethylene glycol/choline chloride based Deep Eutectic Solvent. An up to 10-fold decrease in the wear volume is observed by the incorporation of SiC or Al2O3 particles. The work also addresses the fundamental aspect of speciation of silver chloride in solution using EXAFS to probe solution structure. The size but not the nature of the composite particles is seen to change the morphology and grain size of the silver deposit. Grain sizes are shown to be consistent with previous nucleation studies. The addition of LiF is found to significantly affect the deposit morphology and improve wear resistance.

Graphical abstract: The electrodeposition of silver composites using deep eutectic solvents

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Article information

DOI
https://doi.org/10.1039/C2CP23712A
Article type
Paper
Submitted
23 Nov 2011
Accepted
13 Dec 2011
First published
14 Dec 2011

Phys. Chem. Chem. Phys., 2012,14, 2443-2449

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The electrodeposition of silver composites using deep eutectic solvents

A. P. Abbott, K. E. Ttaib, G. Frisch, K. S. Ryder and D. Weston, Phys. Chem. Chem. Phys., 2012, 14, 2443 DOI: 10.1039/C2CP23712A

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