Issue 21, 2019

Control of hexagonal boron nitride dielectric thickness by single layer etching

Abstract

This work demonstrates a layer-by-layer etching technique to control the hexagonal boron nitride (h-BN) film thickness with single layer precision. The method involves top layer h-BN deformation via oxygen-radical adsorption and then top layer removal by nitrogen-ion bombardment. An ultimate monolayer h-BN with a smooth surface can be obtained from a thick flake by using the method repeatedly. The mechanism of the single layer h-BN etching is verified using X-ray photoelectron spectroscopy analysis and first principle molecular dynamics. Characterization of the dielectric properties of a thickness-reduced h-BN film shows a desirable low leakage current, large capacitance and high breakdown field properties as a gate dielectric material.

Graphical abstract: Control of hexagonal boron nitride dielectric thickness by single layer etching

Supplementary files

Article information

Article type
Paper
Submitted
15 Feb 2019
Accepted
02 Apr 2019
First published
04 Apr 2019

J. Mater. Chem. C, 2019,7, 6273-6278

Control of hexagonal boron nitride dielectric thickness by single layer etching

Z. Ma, C. Prawoto, Z. Ahmed, Y. Xiao, L. Zhang, C. Zhou and M. Chan, J. Mater. Chem. C, 2019, 7, 6273 DOI: 10.1039/C9TC00896A

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