Issue 6, 2018, Issue in Progress

Polymer/oxide bilayer dielectric for hysteresis-minimized 1 V operating 2D TMD transistors

Abstract

Despite their huge impact on future electronics, two-dimensional (2D) dichalcogenide semiconductor (TMD) based transistors suffer from the hysteretic characteristics induced by the defect traps located at the dielectric/TMD channel interface. Here, we introduce a hydroxyl-group free organic dielectric divinyl-tetramethyldisiloxane-bis (benzocyclobutene) (BCB) between the channel and conventional SiO2 dielectric, to practically resolve such issues. Our results demonstrate that the electrical hysteresis in the n-channel MoS2 and p-channel MoTe2 transistors were significantly reduced to less than ∼20% of initial value after being treated with hydrophobic BCB dielectric while their mobilities increased by factor of two. Such improvements are certainly attributed to the use of the hydroxyl-group free organic dielectric, since high density interface traps are related to hydroxyl-groups located on hydrophilic SiO2. This concept of interface trap reduction is extended to stable low voltage operation in 2D MoTe2 FET with 30 nm BCB/10 nm Al2O3 bilayer dielectric, which operates well at 1 V. We conclude that the interface engineering employing the BCB dielectric offers practical benefits for the high performance and stable operation of TMD-based transistors brightening the future of 2D TMD electronics.

Graphical abstract: Polymer/oxide bilayer dielectric for hysteresis-minimized 1 V operating 2D TMD transistors

Supplementary files

Article information

Article type
Paper
Submitted
21 Nov 2017
Accepted
08 Jan 2018
First published
12 Jan 2018
This article is Open Access
Creative Commons BY license

RSC Adv., 2018,8, 2837-2843

Polymer/oxide bilayer dielectric for hysteresis-minimized 1 V operating 2D TMD transistors

M. Yoon, K. R. Ko, S. Min and S. Im, RSC Adv., 2018, 8, 2837 DOI: 10.1039/C7RA12641G

This article is licensed under a Creative Commons Attribution 3.0 Unported Licence. You can use material from this article in other publications without requesting further permissions from the RSC, provided that the correct acknowledgement is given.

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