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Microfabrication of Piezoelectric MEMS

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Abstract

In this paper we present an overview of processes for fabrication of piezoelectric thin film devices using PZT (Pb(Zr x Ti1 − x )O3) in planar structures. These structures are used in cantilever-like and membrane configurations for sensing and actuation. Elaboration of a compatible wet and dry etching sequence for patterning of PZT, electrodes, SiO2 and silicon substrate is the key issues. The method for compensation of mechanical stresses to obtain flat, multilayer structures is demonstrated. Definition of membrane thickness and release of the structures are obtained by Deep Reactive Ion Etching of silicon (SOI—silicon on insulator substrates) or by surface micromachining. The complete process has been used for fabrication of cantilever arrays, ultrasonic transducers and pressure sensors. Excellent permittivity and transverse piezoelectric coefficient of PZT have been obtained with the final devices. Other examples of applications like: ferroelectric memories, nanopatterning and local growth of PZT are presented as well.

The microfabrication of piezoelectric MEMS was found to be a complex task where all aspects from device design, material properties and microfabrication to assessment of performance are closely interconnected.

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  1. Ceramics Laboratory, Engineering Faculty, Swiss Federal Institute of Technology EPFL, CH-1015, Lausanne, Switzerland

    J. Baborowski

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Baborowski, J. Microfabrication of Piezoelectric MEMS. Journal of Electroceramics 12, 33–51 (2004). https://doi.org/10.1023/B:JECR.0000034000.11787.90

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