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Multiple film cracking in film/substrate systems with residual stresses and unidirectional loading

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Abstract

Multiple film cracking in film/substrate systems is analyzed in the present study. Specifically, the experimental measurements of multiple cracking of SiO x films of various thicknesses on polyethylene terephthalate substrates are analyzed. The system is subjected to both residual stresses and unidirectional tensile loading. Considering a three- dimensional geometry, an analytical model is developed to derive the stress distribution in the system, and the film-cracking problem is analyzed using both the strength and the energy criteria. Compared to the strength criterion, the energy criterion shows better agreement with the measurements of the crack density versus applied strain relation.

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References

  1. W. D. Nix, Metall. Trans. 20A (1989) 2217.

    Google Scholar 

  2. J. Rice, Food Process June (1992) 78.

  3. J. T. Felts, J. Plas. Film Sheet 9 (1993) 139.

    Google Scholar 

  4. J. C. Grosskreutz and M. B. Mcneil, J. Appl. Phys. 40 (1969) 355.

    Google Scholar 

  5. F. Faupel, C. H. Yang, S. T. Chen and P. S. Ho, ibid. 65 (1989) 1911.

    Google Scholar 

  6. T. R. Watkins and D. J. Green, J. Amer. Ceram. Soc. 76 (1993) 3066.

    Google Scholar 

  7. Y. Leterrier, J. Andersons, Y. Pitton and J.-A. E. MÅnson, J. Polym. Sci. B: Polym. Phys. 35 (1997) 1463.

    Google Scholar 

  8. M. Yanaka, T. Miyamoto, Y. Tsukahara and N. Takeda, Composite Interfaces 6 (1999) 409.

    Google Scholar 

  9. H. Bordet, M. Ignat and M. Dupeux, Thin Solid Films 315 (1998) 207.

    Google Scholar 

  10. B. F. Chen, J. Hwang, G. P. Yu and J. H. Huang, ibid. 352 (1999) 173.

    Google Scholar 

  11. H. L. Cox, Brit. J. Appl. Phys. 3 (1952) 72.

    Google Scholar 

  12. M. S. Hu and A. G. Evans, Acta Metall. 37 (1989) 917.

    Google Scholar 

  13. F. S. Shieu, R. Raj and S. L. Sass, Acta Metall. Mater. 38 (1990) 2215.

    Google Scholar 

  14. N. Laws and G. J. Dvorak, J. Compos. Mater. 22 (1988) 901.

    Google Scholar 

  15. C. H. Hsueh, J. Amer. Ceram. Soc. 84 (2001) 2955.

    Google Scholar 

  16. Idem., J. Appl. Phys. 88 (2000) 3022.

    Google Scholar 

  17. H. Tada, P. C. Paris and G. R. Irwin, “The Stress Analysis of Cracks Handbook” (Paris Production, Inc., St. Louis, Missouri, 1985) p. 15.1.

    Google Scholar 

  18. M. D. Thouless, E. Olsson and A. Gupta, Acta Metall. Mater. 40 (1992) 1287.

    Google Scholar 

  19. P. R. Ramsey, H. W. Chandler and T. F. Page, Thin Solid Films 201 (1991) 81.

    Google Scholar 

  20. E. Delannay and P. Warren, Acta Metall. Mater. 39 (1991) 1061.

    Google Scholar 

  21. J. H. Selverian and D. O'Neil, Thin Solid Films 235 (1993)120.

    Google Scholar 

  22. A. MÉzin and B. Sajid, ibid. 358 (2000) 46.

    Google Scholar 

  23. C. H. Hsueh, E. R. Fuller, S. A. Langer and W. C. Carter, Mater. Sci. Eng. A 268 (1999) 1.

    Google Scholar 

  24. C. H. Hsueh and A. G. Evans, J. Amer. Ceram. Soc. 68 (1985) 241.

    Google Scholar 

  25. G. P. Cherepanov, J. Appl. Phys. 75 (1994) 844.

    Google Scholar 

  26. B. Lawn and R. Wilshaw, “Fracture” (Cambridge University Press, 1975) p. 77.

  27. Y. Leterrier, L. Boogh, J. Andersons and J.-A. E. MÅnson, J. Polym. Sci. B: Polym. Phys. 35 (1997) 1449.

    Google Scholar 

  28. M. Yanaka, Y. Tsukahara, T. Okabe and N. Takeda, J. Appl. Phys. 90 (2001) 713.

    Google Scholar 

  29. S. C. Jain, A. H. Harker, A. Atkinson and K. Pinardi, ibid. 78 (1995) 1630.

    Google Scholar 

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Authors and Affiliations

  1. Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee, 37831

    C. H. Hsueh

  2. Toppan Technical Research Institute, Sugito-machi, Kitakatsushika-gun, Saitama, 345-8508, Japan

    M. Yanaka

Authors
  1. C. H. Hsueh
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  2. M. Yanaka
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Hsueh, C.H., Yanaka, M. Multiple film cracking in film/substrate systems with residual stresses and unidirectional loading. Journal of Materials Science 38, 1809–1817 (2003). https://doi.org/10.1023/A:1023200415364

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  • DOI: https://doi.org/10.1023/A:1023200415364

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