Spallation caused by the diffusion and agglomeration of vacancies in ductile metals
Introduction
Due to the wide spectrum of issues ranging across defense and industrial applications, material behaviors at high pressure, high strain and high strain-rate physical processes, e.g. spallation process, is interesting in science. For the ductile metal in the spallation process, typically possessing the above extreme physical conditions, the dynamic damage occurs and is experimentally found to exist in the form of voids of different sizes in the spallation planes (Qi et al., 2011, Belak, 2004, Pei, 2013). In the spallation process, the dynamic behaviors, such as the nucleation rate of void, void growth velocity, coalescence of voids, damage evolution rate and so on, are paramount importance and have been investigated persistently in experiments and theoretically in the last four decades (Qi et al., 2011, Belak, 2004, Pei, 2013, Seaman et al., 1976, Gurson, 1977, Johnson and Addessio, 1988, Curran et al., 1987, Strachan et al., 2001, Reina et al., 2011). However, up to date, owing to the lacking of effective in situ dynamic characterizations, it is still difficult to investigate the dynamic behaviors in the spallation process in experiments. Also, due to the obstacle brought by the cross-scale dynamic features of the spallation phenomena in the space and time, it is challenging to describe the spallation phenomena in theory. Because of the difficulties and challenges in both the experiments and theory, the spallation phenomena have not been understood well and the effective theoretical description is still an open problem.
In this paper, the spallation process for the ductile metal under the plane shock loading is systematically discussed in theory. By means of the phase transition theory, non-equilibrium transport theory and the subsequent theoretical analysis, the conclusions are obtained: the spalling temperature, a new concept, is proposed first and the spallation critical behavior is proved to exist; the quantitative grain size, tensile strain rate and temperature dependence of both the damage evolution rate and the void growth velocity is obtained, i.e., a larger grain size, tensile strain rate and higher temperature will cause a larger damage evolution rate and void growth velocity; the existence of a characteristic size for the voids and a characteristic stress at the void boundary is discovered first, and their magnitude depend on the vacancy excitation energy and the average volume of one vacancy; the temperature for the metal adjacent to the growing void is found to be so high that it is possible to melt the metal, but it decreases quickly with the distance away from the void; the area of the plastic zone surrounding one formed spherical void is clarified; against the widely accepted viewpoint that the void growth is induced by the emission of dislocations (Belak, 2004), the distinctive viewpoint is put forward that when the shocking temperature approaches spalling temperature the void growth may arise from the agglomeration of vacancies rather than the emission of dislocations.
Section snippets
Theory and discussion
As is known, the spallation process is indeed one multi-scale problem. It composes of several main stages, void nucleation, void growth and void coalescence. For the different stages, the space scale crosses the microscale, mesoscale and macroscale and the time crosses many scales too. How can one theory describe the characters in the quite different scales? For the classical approach, it could describe some features in mesoscale or microscale. However, it fails to grasp the micro-properties of
Conclusions
In summarized, the spallation process for the ductile metals under plane shock loading is discussed in theory. By employing the phase transition theory and non-equilibrium transport theory, the spallation process may be understood as a result of the diffusion and agglomeration of the generated vacancies. Through the detailed theoretical analysis, the following important points are concluded for the dynamic spallation process: (1) the spalling temperature, a new concept, is proposed first and
Acknowledgements
The author is grateful to colleagues Guangfu Ji, Hongliang He, Wenjun Zhu and Liang Wang for the helpful discussions and the amounts of provided information.
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