Microelectronics ReliabilityVolume 43, Issues 9–11, September–November 2003, Pages 1377-1382Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protectionsAuthor links open overlay panelA. Andreini a, C. Neva a, L. Renard b, G. Sironi a, F. Speroni a, L. Sponton b, F. Tampellini b, R. Tiziani bShow moreShareCitehttps://doi.org/10.1016/S0026-2714(03)00245-2Get rights and contentFirst page previewClick to open first page previewView PDFRecommended articlesReferences (0)Cited by (0)View full textCopyright © 2003 Elsevier Science Ltd. All rights reserved.