Low frequency noise in 0.12 μm partially and fully depleted SOI technology
Introduction
Silicon-on-insulator (SOI) devices have shown over the last past years promising advantages over the Si bulk technology, especially for low power/low voltage integrated circuits due to significantly improved electrical properties such as increased driving current, lower parasitic source/drain capacitances and total dielectric isolation. Two device architectures have consequently gained a growing interest beside semiconductor suppliers: fully depleted (FD) and partially depleted (PD) MOSFETs which both present some special peculiarities [1], [2], [3] due to the presence of a buried oxide layer. As far as PD devices are concerned, they exhibit floating body effects such as the Kink effect, parasitic bipolar transistor, etc… Indeed, the neutral zone within the silicon film attracts holes issued from the impact ionization occurring at the drain edge, and the body potential consequently increases, which contributes to a decrease of the threshold voltage, and a drain current increase (Kink effect). If the body potential is large enough, the source-to-body junction is forward biased, activating the parasitic bipolar transistor action. Regarding the FD architecture, the most relevant point to figure out is the interface coupling effects between the front and back gates due to a reduced silicon film thickness (30 nm in this study). This means that the electrical properties (such as the threshold voltage, the subthreshold slope…) at one interface are dependent from the applied biases at the opposite interface [4].
Low frequency noise analysis in MOSFETs is a relevant characterization tool, and provides pertinent information about the maturity level and the evaluation of a given technology. Shrinking MOS devices to very deep-submicron dimensions, an increase of the overall 1/f noise may alter device performances in terms of analogue or digital circuit applications, and needs to be investigated. Up to now, 1/f noise on 0.25 μm SOI N-MOSFETs has been extensively studied in the literature for both PD and FD architectures [5], [6], but, to our knowledge, only a few results [7] have been already reported on 0.12 μm PD SOI CMOS technology. Nevertheless, this is a rather important study to carry out, in order to see if the existing noise models [8] are still suitable, and to evaluate the impact of scaling down on low frequency noise levels.
After having considered the transfer and output characteristics, we present the normalized drain current power spectral densities in the linear regime (Vd=50 mV) for both PD and FD N-MOSFETs. Then, in the saturation regime, we focus on the presence or absence of the conventional Kink-related excess noise for PD devices, whereas we also show the appearance of a Kink excess noise for FD devices, already observed in 0.25 μm moderately FD N-MOSFETs [9], but for higher frequencies.
Section snippets
Experimental details
As regards PD devices, two technologies were used in this study: 0.13 μm (Lpoly) devices processed on Unibond substrates at IMEC (Leuven, Belgium) and 0.12 μm (Lpoly) devices (also on Unibond substrates) provided by STMicroelectronics (Crolles, France). Front oxide thickness was Tox1=2.5 nm for IMEC devices (resp. Tox1=2 nm for STMicroelectronics ones), silicon film thickness TSi=100 nm for IMEC devices (resp. TSi=150 nm for STMicroelectronics ones), and back oxide thickness Tox2=400 nm. IMEC
Static characteristics
In this section are reported the transfer and output characteristics of both PD and FD devices. Fig. 2 shows the transfer characteristics Id (Vg1) for W/L=10/0.12 and 10/0.13 μm PD N-MOSFETs with Vd=50 mV. A lower extrapolated threshold voltage (not shown here) for 0.12 μm N-MOSFETs is obtained, which results from different channel doping and architecture between the two provided technologies. Similar subthreshold behaviour is nevertheless noticed for our devices, and we extracted a
Low frequency noise characterization
We will now consider low frequency noise measurements carried out for PD and FD devices in both linear and saturation regimes to identify the main noise sources as well as to calculate the trap densities at the front gate oxide interface.
Conclusion
Low frequency noise in both PD and FD N-MOSFETs was presented for the 0.12 μm SOI CMOS technology node. An enhancement of the overall noise level is noticeable compared to previously obtained results on the 0.25 μm SOI CMOS node. In linear regime, the noise source was attributed to carrier number fluctuations. Trap densities of a few 1018/eV/cm3 were calculated. As regards PD devices, the Kink-related excess noise magnitude is reduced, especially in terms of Lorentzian-like spectra and corner
Acknowledgements
This work was supplied within the SATURN IST 105 21 European research project on SOI devices. The author would like to thank Dr. Christine Raynaud from STMicroelectronics (Crolles, France), Dr. Kristin De Meyer and Dr. Hans Van Meer from IMEC (Leuven, Belgium) for providing the devices used in this study.
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