Skip to main content
SpringerLink
Log in

SiC chip attachment sintered by nanosilver paste and their shear strength evaluation

  • Research Paper
  • Published:
Welding in the World Aims and scope Submit manuscript

Abstract

In this study, a nanosilver paste was prepared by silver nanoparticles and organics, by which an SiC ship could be sintered on the direct bonding copper (DBC) substrate at 250–300 °C. The nanosilver paste firmly sintered the SiC chip and DBC substrate, and die attachment had an excellent bonding interface. Die-shear results showed that the shear strength increased with the increase of sintering temperature and was more than the value required by the MIL-STD-883J standard. When high assisted pressure was applied, the sintering temperature could be lowered and sintering time also could be shortened to realize attaching high bonding strength. The assisted pressure also influenced the porosity of the bondline. X-ray non-destructive method was used to measure the porosity of die attachment. The results showed that the shear strength of die attachment decreased with the increase of bondline porosity.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11

Similar content being viewed by others

References

  1. Qin H, Zhao B, Nie X, Wen J, Yan Y (2013) 8th conference on industrial electronics and applications. Melbourne, Australia

  2. Lu G-Q, Calata JN, Lei G, Chen X (2007) 2007 international conference on thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems. London, UK

  3. Neudeck PG, Okojie RS, Chen L-Y (2002) High-temperature electronics-a role for wide bandgap semiconductors. IEEE 90:1065–1076

    Article  Google Scholar 

  4. Kisiel R, Szczepański Z, Firek P, Grochowski J, Myśliwiec M, Guziewicz M (2012) 35th international spring seminar on electronics technology. Bad Aussee, Austria

  5. Chin HS, Cheong KY, Ismail AB (2010) A review on die attach materials for SiC-based high-temperature power devices. Metall Mater Trans B Process Metall Mater Process Sci 41:824–832

    Article  Google Scholar 

  6. Zhang GS, Jing HY, Xu LY, Wei J, Han YD (2009) Creep behavior of eutectic 80Au/20Sn solder alloy. J Alloys Compd 476:138–141

    Article  Google Scholar 

  7. Lei TG, Calata JN, Lu G, Chen X, Luo S (2010) Low-temperature sintering of nanoscale silver paste for attaching large-area chips. IEEE Trans Compon Packag Technol 33:98–104

    Article  Google Scholar 

  8. Maruyama M, Matsubayashi R, Iwakuro H, Isoda S, Komatsu T (2008) Silver nanosintering: a lead-free alternative to soldering. Appl Phys A Mater Sci Process 93:467–470

    Article  Google Scholar 

  9. Wang S, Li M, Ji H, Wang C (2013) Rapid pressureless low-temperature sintering of ag nanoparticles for high-power density electronic packaging. Scr Mater 69:789–792

    Article  Google Scholar 

  10. Fu S, Mei Y, Lu G-Q, Li X, Chen G, Chen X (2014) Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging. Mater Lett 128:42–45

    Article  Google Scholar 

  11. Alayli N, Schoenstein F, Girard A, Tan KL, Dahoo PR (2014) Spark plasma sintering constrained process parameters of sintered silver paste for connection in power electronic modules: microstructure, mechanical and thermal properties. Mater Chem Phys 148:125–133

    Article  Google Scholar 

  12. Duch S, Krebs T, Schmitt W (2016) 9th international conference on integrated power electronics systems

  13. Huang C, Becker MF, Keto JW, Kovar D (2007) Annealing of nanostructured silver films produced by supersonic deposition of nanoparticles. J Appl Phys 102:054308

    Article  Google Scholar 

  14. Zuruzi AS, Siow KS (2015) Electrical conductivity of porous silver made from sintered nanoparticles. Electron Mater Lett 11:308–314

    Article  Google Scholar 

  15. Jakubowska M, Jarosz M, Kiełbasinski K, Młożniak A (2011) New conductive thick-film paste based on silver nanopowder for high power and high temperature applications. Microelectron Reliab 51:1235–1240

    Article  Google Scholar 

  16. Gillman A, Roelofs MJGH, Matouš K, Kouznetsova VG, van der Sluis O, van Maris MPFHL (2017) Microstructure statistics–property relations of silver particle-based interconnects. Mater Des 118:304–313

    Article  Google Scholar 

  17. Yu F, Cui J, Zhou Z, Fang K, Johnson RW, Hamilton MC (2017) Reliability of Ag sintering for power semiconductor die attach in high-temperature applications. IEEE Trans Power Electron 32:7083–7095

    Article  Google Scholar 

  18. Zhang H, Wang W, Bai H, Zou G, Liu L, Peng P, Guo W (2019) Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications. J Alloys Compd 774:487–494

    Article  Google Scholar 

  19. Fang ZZ, Wang H (2008) Densification and grain growth during sintering of nanosized particles. Int Mater Rev 53:326–352

    Article  Google Scholar 

  20. Ishizaki T, Watanabe R (2012) A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding. J Mater Chem 22:25198–25206

    Article  Google Scholar 

  21. Yasuda Y, Morita T, Kawaji H (2014) Low-temperature reduction of silver oxide particles with long chain alcohol. J Therm Anal Calorim 115:1583–1591

  22. Zhang H, Zhao Z, Zou G, Wang W, Liu L, Zhang G, Zhou Y (2019) Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications. Microelectron Reliab 94:46–55

    Article  Google Scholar 

  23. Munir ZA, Anselmi-Tamburini U, Ohyanagi M (2006) The effect of electric field and pressure on the synthesis and consolidation of materials: A review of the spark plasma sintering method. J Mater Sci 41:763–777

  24. Coble RL (1963) A model for boundary diffusion controlled creep in polycrystalline materials. J Appl Phys 34:1679–1682

  25. Wang T, Chen X, Lu G-Q, Lei G-Y (2007) Low-temperature sintering with nano-silver paste in die-attached interconnection. J Electron Mater 36:1333–1340

    Article  Google Scholar 

  26. Kang S-JL (2004) Sintering: densification, grain growth and microstructure. Elsevier Butterworth-Heinemann, Burlington

    Google Scholar 

  27. Zhang Z, Lu G-Q (2002) Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow. IEEE T Electron Pack 25:279–283

  28. Kuramoto M, Kunimune T, Ogawa S, Niwa M, Kim KS, Suganuma K (2012) Low-temperature and pressureless Ag-Ag direct bonding for light emitting diode die-ttachment. IEEE T Comp Pack Man 2:548–552

  29. Fu S, Mei Y, Li X, Ma C, Lu G-Q (2017) Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests. IEEE Trans Power Electron 32:6049–6058

  30. Weber C, Hutter M, Oppermann H, Lang KD (2014) IEEE international conference for power electronics, intelligent motion, Renewable energy and energy management. Nuremberg, Germany

  31. Kähler J, Heuck N, Palm G, Stranz A, Waag A, Peiner E (2011) 18th European Microelectronics and Packaging Conference, Brighton, UK

Download references

Funding

This work was supported by the National Key Research and Development Program of China (2017YFB1104900) and the National Natural Science Foundation of China (Grant No. 51520105007, 51775299).

Author information

Authors and Affiliations

  1. School of Mechanical Engineering and Automation, Beihang University, Beijing, 100191, People’s Republic of China

    Hongqiang Zhang, Peng Peng & Wei Guo

  2. Department of Mechanical Engineering, Tsinghua University, Beijing, 100084, People’s Republic of China

    Hailin Bai, Guisheng Zou & Lei Liu

Authors
  1. Hongqiang Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hailin Bai
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Peng Peng
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Wei Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Guisheng Zou
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Lei Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Guisheng Zou.

Additional information

Publisher’s note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Recommended for publication by Commission VII - Microjoining and Nanojoining

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Zhang, H., Bai, H., Peng, P. et al. SiC chip attachment sintered by nanosilver paste and their shear strength evaluation. Weld World 63, 1055–1063 (2019). https://doi.org/10.1007/s40194-019-00736-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s40194-019-00736-x

Keywords

Search

Navigation