Abstract
The use of aluminum and copper materials increases due to their excellent electrical and thermal characteristics. The growth and the type of intermetallic compounds were varied with the various conditions in fusion welding. The present study focuses on the joining of aluminum to copper by friction welding to characterize the intermetallic layer in the interface. Heat treatment was applied for the welds using a constant temperature of 300 °C for the duration of 6 h, 12 h and 24 h. The growth of the intermetallics and their characteristics were examined by microscopic and energy-dispersive X-ray spectroscopy studies. The interdiffusion, growth rate and thickness of the intermetallic compounds were evaluated according to the heating time. The tensile strength and resistance of the welds gradually reduced with increasing the thickness of the intermetallic compounds. The fracture morphology of the welds was investigated by scanning electron microscopy on both sides of the welds.
Similar content being viewed by others
References
Muralimohan C H, Haribabu S, Reddy Y H, Muthupandi V, and Sivaprasad K, Procedia Mater Sci5 (2014) 1107.
Joerg K, Zimmermann M, Ostwaldt A, Goebel G, Standfuß J, and Brenner B, Mater Sci Forum783 (2014) 1747.
Muralimohan C H, Ashfaq M, Ashiri R, Muthupandi V, and Sivaprasad K, Metall Mater Trans A47 (2016) 347.
Cheepu M, and Che W S, Trans Indian Inst Met72 (2019) 1563.
Yang J, and Cao B, Mater Des74 (2015) 19.
Cheepu M, and Che W S, J Weld Join37 (2019) 46.
Muralimohan C H, and Muthupandi V, Adv Mater Res794 (2013) 351.
Venkateswarlu D, Cheepu M, Rao P N, Kumaran S S, and Srinivasan N, Mater Sci Forum969 (2019) 205.
Krishnaja D, Cheepu M, and Venkateswarlu D, IOP Conf Ser: Mater Sci Eng 330 (2018) 012073.
Ouyang J, Yarrapareddy E, and Kovacevic R, J Mater Proces Technol172 (2006) 110.
Wang X G, Yan F J, and Wanf C G, Sci Tech Weld Join22 (2017) 170.
Muralimohan C H, Haribabu S, Reddy Y H, Muthupandi V, and Sivaprasad K, J Adv Mech Eng Sci1 (2015) 57.
Zuo D, Hu S, Shen J, and Xue Z, Mater Des58 (2014) 357.
Cheepu M, and Che W S, Trans Indian Inst Met72 (2019) 1597.
Cheepu M, Venkateswarlu D, Rao P N, Muthupandi V, Sivaprasad K, and Che W S, Mater Sci Forum969 (2019) 211.
Meshram SD and Reddy GM, Def Technol11 (2015) 292.
Cheepu M M, Muthupandi V, and Loganathan S, Mater Sci Forum710 (2012) 620.
Muralimohan C H, Muthupandi V, and Sivaprasad K, Inter J Mater Res105 (2014) 350.
Cheepu M, Ashfaq M, and Muthupandi V, Trans Indian Inst Met70 (2017) 2591.
Muralimohan C H, Muthupandi V, and Sivaprasad K, Procedia Mater Sci5 (2014) 1120.
Cheepu M, Muthupandi V, and Che W S, Appl Mech Mater877 (2018) 157.
Guo Y, Liu G, Jin H, Shi Z, and Qiao G, J Mater Sci46 (2011) 2467.
Sharma N, Khan Z A, and Siddiquee A N, Trans Nonferrous Met Soc China27 (2017) 2113.
Zhang Q Z, Gong W B, and Liu W, Trans Nonferrous Met Soc China25 (2015) 1779.
Cheepu M, Muthupandi V, and Che W S, in The Minerals, Metals & Materials Series, TMS 2019 148th Annual Meeting & Exhibition Supplemental Proceedings. The Minerals, Metals & Materials Series. Springer, Cham (2019) p 259.
Cheepu M, and Susila P, Trans Indian Inst Met (2020).
Cheepu M, Muthupandi V, Srinivas B, and Sivaprasad K, in Techno-Societal 2016, International Conference on Advanced Technologies for Societal Applications, (eds) Pawar P M, Ronge B P, Balasubramaniam R, and Seshabhattar S, ICATSA 2016, Springer, Cham (2018), p 709.
Kong Y S, Cheepu M, and Park Y W, Trans Indian Inst Met (2020).
Cheepu M, Muthupandi V, Venkateswarlu D, Srinivas B, and Che W S, Advanced Materials, (eds) Parinov I, Chang S H, and Gupta V, PHENMA 2017, Springer (2017) vol 207, p 267.
Kong Y-S, Cheepu M, and Kim D-G, Trans Indian Inst Met (2020).
Cheepu M, and Che W S, Trans Indian Inst Met (2020).
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
P. Susila: On-deputation to BIT campus, Anna University Trichy.
Rights and permissions
About this article
Cite this article
Cheepu, M., Susila, P. Growth Rate of Intermetallics in Aluminum to Copper Dissimilar Welding. Trans Indian Inst Met 73, 1509–1514 (2020). https://doi.org/10.1007/s12666-020-01905-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12666-020-01905-z